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1W 3W High Power 3535 White SMD LED , Brightest Led Chip 2.8-3.8 Voltage

Categories White SMD LED
Brand Name: Doule Light
Model Number: DL-PCB3535W
Certification: RoHS/ REACH
Place of Origin: China
MOQ: 100pcs/Real
Price: US$0.13-0.3 Per piece or Price Negotiable
Payment Terms: Telegraphic Transfer in Advance (Advance TT, T/T)
Supply Ability: 2,000,000pcs per day
Product Name: 1W&3W High Power 3535 White LED
Package: High Power LED
Emitted Color: White
Product number: DL-PCB3535W
Color Temperature: 2600-7000K
Forward Voltage: 2.8-3.8V
Forward Current: 350mA/700mA
Luminous Flux: 120-130lm/ 220-240lm
Viewing Angle: 90 Deg
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    1W 3W High Power 3535 White SMD LED , Brightest Led Chip 2.8-3.8 Voltage

    Datasheet:DL-PCB3535W.pdf light source: White

    DL-PCB3535W


    This is our 1W&3W High Power 3535 White LED,its color is available in white, green, blue, red, yellow, Amber according to your need.


    Part No.Chip MaterialLens ColorSource Color
    DL-PCB3535WInGaNWhite DiffusedWhite

    Notes:

    • The marked is cathode.
    • All dimensions are in millimeters.
    • Tolerance is ± 0.25 mm (.010″) unless otherwise noted.

    Specifications are subject to change without notice.


    Features:

    • Small package with high efficiency
    • Long operating life.
    • Available in white, green, blue, red, yellow, Amber
    • Typical color temperature: 5500-6500 K.
    • View angle: 120°.
    • Low voltage DC operated.
    • The product itself will remain within RoHS compliant Version.
    • ESD protection.

    Applications:

    • Reading lights (car, bus, aircraft).
    • Portable (flashlight, bicycle).
    • Mini_accent/Uplighters/Downlighters/Orientation.
    • Bollards/Security/Garden.
    • Cove/Undershelf/Task.
    • Automotive rear combination lamps.
    • Traffic signaling/Beacons/ Rail crossing and Wayside.
    • Indoor/Outdoor Commercial and Residential Architectural.
    • Edge_lit signs (Exit, point of sale).
    • LCD Backlights/Light Guides.

    Absolute Maximum Ratings at Ta=25


    ParametersSymbolMax.Unit
    Power DissipationPD3000mW

    Peak Forward Current

    (1/10 Duty Cycle, 0.1ms Pulse Width)

    IFP1000mA
    Forward CurrentIF350/700mA
    Reverse VoltageVR5V
    Electrostatic Discharge (HBM)ESD4000V
    Operating Temperature RangeTopr-10℃ to +70℃
    Storage Temperature RangeTstg-20℃ to +80℃
    Soldering TemperatureTsld260℃ for 5 Seconds

    Electrical Optical Characteristics at Ta=25


    ParameterSymbolMin.Typ.Max.UnitTest Condition
    Luminous FluxΦ100120130lmIf=350mA (Note 1)
    200220240lmIf=700mA (Note 1)
    Viewing Angle2θ(1/2)---90---Deg(Note 2)
    Color TemperatureTC5500---6500KIf=350/700mA
    Forward VoltageVF2.803.403.80VIf=350/700mA
    Reverse CurrentIR------10µAVR=5V

    Notes:

    1. θ1/2 is the off-axis angle at which the luminous intensity is half the axial luminous intensity.


    Reliability Test Items And Conditions:

    The reliability of products shall be satisfied with items listed below:

    Confidence level: 90%.

    LTPD: 10%.

    No.ItemTest Conditions

    Test Hours/

    Cycles

    Sample

    Sizes

    Failure

    Judgment

    Criteria

    Ac/

    Re

    1Reflow Soldering

    TEMP.: 260℃+5℃

    5secs

    6mins22pcs

    IR≧U*2

    Ee≦L*0.8

    VF≧U*1.2


    U: Upper

    Specification

    Limit

    L: Lower

    Specification

    Limit


    0/1
    2Temperature Cycle

    H: +100℃ 15mins

    5 mins

    L: -40℃ 15mins

    50Cycles22pcs0/1
    3Thermal Shock

    H: +100℃ 15mins

    10mins

    L: -10℃ 5mins

    50Cycles22pcs0/1
    4

    High Temperature

    Storage

    TEMP.: +100℃1000hrs22pcs0/1
    5

    Lower Temperature

    Storage

    TEMP.: -40℃1000hrs22pcs0/1
    6DC Operating LifeVCE=5V1000hrs22pcs0/1
    7

    High Temperature/

    High Humidity

    85℃ / 85% R.H.1000hrs22pcs0/1

    Precautions for Use:

    • Over-current-proof

    Customer must apply resistors for protection, otherwise slight voltage shift may cause enormous current change and burn out failure would happen.

    • Storage
      • Do not open moisture proof bag before the products are ready to use.
      • Before opening the package, the Infrareds should be kept at 30℃ or less and 90%RH or less.
      • The Infrared LED should be used within a year.
      • After opening the package, the Infrareds should be kept at 30℃ or less and 70%RH or less.
      • The Infrared LED should be used within 168 hours (7 days) after opening the package.
      • If the moisture absorbent material (silicone gel) has faded away or the Infrareds have exceeded the storage time, baking treatment should be performed using the following conditions.
      • Pre-curing treatment: 60±5℃ for 24 hours.
    • Thermal Management
    • Because the Infrared LED is a high power dissipation device, special and sufficient consideration in thermal management design must be made to optimize the thermal performance.
    • Heat sink design is implemented in the device for an additional thermal connection. Since the device is capable of SMT process, tin must be spread both heat sink and solder pads areas to dissipate the heat.
    • A high thermal conductivity substrate, such as Aluminum or Copper plate etc, must be applied for external thermal management. It is strongly recommended that the outer heat sink or PCB dimension per Infrared LED can not be less than 25 x 25 x 1 (L x W x H) mm. The materials for outer heat sink can be FR4 on Aluminum, MCPCB, or FPC on Aluminum.
    • Special thermal designs are also recommended to take in outer heat sink design, such as FR4 PCB on Aluminum with thermal vias or FPC on Aluminum with thermal conductive adhesive, etc.
    • Sufficient thermal management must be conducted, or the die junction temperature will be over the limit under large electronic driving and Infrared LED lifetime will decrease critically.
    • Soldering Condition
    • Reflow soldering should not be done more than two times.
    • While soldering, do not put stress on the Infrareds during heating.
    • After soldering, do not warp the circuit board.
    • Soldering Iron
    • For prototype builds or small series production runs it is possible to place and solder the LED by hand.
    • Dispensing thermal conductive glue or grease on the substrates and follow its curing spec. Press Infrared housing to closely connect Infrared and substrate.
    • It is recommended to hand solder the leads with a solder tip temperature of 280°C for less than 3 seconds within once in less than the soldering iron capacity 25W. Leave two seconds and more intervals, and do soldering of each terminal.
    • Be careful because the damage of the product is often started at the time of the hand solder.

    • Handling Indications
    • During processing, mechanical stress on the surface should be minimized as much as possible.
    • Sharp objects of all types should not be used to pierce the sealing compound.

    For other parameters and pictures, please see the attachment PDF files,thank you.


    For more details, please contact us.
    Email:Facebook@doublelight.com.cn


    Product Tags:

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