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Impedance Controlled PCB 12 Layers High Tg Printed Circuit Board HDI Multilayer PCB Board On 2.0mm FR-4

Categories FR4 PCB Board
Brand Name: Bicheng
Model Number: BIC-476.V1.0
Certification: UL, ISO9001, IATF16949
Place of Origin: CHINA
MOQ: 1PCS
Price: USD9.99-99.99
Payment Terms: T/T
Supply Ability: 5000PCS per month
Delivery Time: 8-9 working days
Packaging Details: Vacuum bags+Cartons
Base material: FR-4
Layer count: 12 layers
PCB thickness: 2.0mm ±10%
PCB size: 257 x 171.5mm=1PCS=1design
Solder mask: Green
Silkscreen: White
Copper weight: 1oz
Surface finish: Immersion gold
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    Impedance Controlled PCB 12 Layers High Tg Printed Circuit Board HDI Multilayer PCB Board On 2.0mm FR-4

    Impedance Controlled PCB 12 Layers High Tg Printed Circuit Board HDI Multilayer PCB Board On 2.0mm FR-4

    (Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)


    1.1 General description

    This is a type of impedance controlled PCB built on FR-4 material with Tg 175°C for the application of Signal transmission. It's a 12-layer board with 2.0 mm thick. It contains 2+N+2 HDI vias (see the stackup & vias). White silkscreens (Taiyo) are on green solder mask (Taiyo) and immersion gold on pads. Both Signal trace impedance and differential pairs impedance are controlled on layers. See the drawing below. The base material is from ITEQ. Entire panel is supplying with single up. They're fabricated per IPC 6012 Class 2 using supplied Gerber data. Each 20 boards are packed for shipment.


    Signal Trace Impedance Control

    Trace LayerTrace Width (mil)Trace Impedance (Ohm)PrecisionReference Layer
    Top Layer450±10%Mid-Layer 1
    L03, Mid-Layer 2450±10%Mid-Layer 1
    L10, Mid-Layer 9450±10%Mid-Layer 7, Mid-Layer 10
    Bottom Layer450±10%Mid-Layer 10

    Differential Pairs Impedance Control

    LayerTrace Width / Space (Mil)Trace Impedance (Ohm)PrecisionFrequency (MHz)
    Top Layer3.1 / 5.5100±10%Mid-Layer 1
    Top Layer4.0 / 5.190±10%Mid-Layer 1
    L03, Mid-Layer 23.1 / 5.9100±10%Mid-Layer 1, Mid-Layer 4
    L06, Mid-Layer 54.0 / 7.4100±10%Mid-Layer 4, Mid-Layer 6
    L06, Mid-Layer 54.0 / 4.790±10%Mid-Layer 4, Mid-Layer 6
    L07, ,Mid-Layer 64.0 / 7.4100±10%Mid-Layer 5, Mid-Layer 7
    L07, ,Mid-Layer 64.0 / 4.790±10%Mid-Layer 5, Mid-Layer 7
    L10, Mid-Layer 93.1 / 5.9100±10%Mid-Layer 7, Mid-Layer 10
    Bottom Layer4.0 / 5.5100±10%Mid-Layer 10
    Bottom Layer4.0 / 5.190±10%Mid-Layer 10

    1.2 Features and benefits

    Lead free assemblies with a maximum reflow temperature of 260℃.

    Long storage time ( It can be stored for more than 1 year in vacuum bag)

    Improved the speed of signal transmission

    PCB manufacturing on required specifications.

    Quick and on-time delivery

    UL recognized and RoHS Directive-compliant

    Prototype PCB capability



    1.3 Applications

    Solar Battery Charger

    GPS Receiver

    Wi Fi Antenna

    USB Wireless Router

    Phone systems


    1.4 Parameter and data sheet

    PCB SIZE257 x 171.5mm=1PCS=1design
    BOARD TYPEMultilayer PCB
    Number of Layers12 Layers
    Surface Mount ComponentsYES
    Through Hole ComponentsYES
    LAYER STACKUPcopper ------- TOP 17um(1oz)+plate 25um
    130 um prepreg 1080 x 2
    copper ------- L02 32um(1oz)
    150um core FR-4
    copper ------- L03 18um(0.5oz)
    130 um prepreg 1080 x 2
    copper ------- L04 18um(0.5oz)
    150um core FR-4
    copper ------- L05 18um(0.5oz)
    130 um prepreg 1080 x 2
    copper ------- L06 18um(0.5oz)
    813um core FR-4
    copper ------- L07 18um(0.5oz)
    130 um prepreg 1080 x 2
    copper ------- L08 18um(0.5oz)
    150um core FR-4
    copper ------- L09 18um(0.5oz)
    130 um prepreg 1080 x 2
    copper ------- L10 18um(0.5oz)
    150um core FR-4
    copper ------- L11 35um(1oz)
    130 um prepreg 1080 x 2
    copper ------- BOT 17um(0.5oz)+plate 25um
    TECHNOLOGY
    Minimum Trace and Space:4 mil / 4 mil
    Minimum / Maximum Holes:0.25 mm / 3.0 mm
    Number of Different Holes:26
    Number of Drill Holes:4013
    Number of Milled Slots:0
    Number of Internal Cutouts:0
    Impedance ControlSingle Signal Impedance and Differential Pairs Impedance
    BOARD MATERIAL
    Glass Epoxy:FR-4, ITEQ IT-180, Tg>175, er<5.4
    Final foil external:1oz
    Final foil internal:1oz
    Final height of PCB:2.0mm ±10%
    PLATING AND COATING
    Surface FinishImmersion Gold (ENIG)( 2 µ" over 100 µ" nickel)
    Solder Mask Apply To:Top and Bottom, 12micon Minimum.
    Solder Mask Color:Green, PSR-2000GT600D, Taiyo supplied.
    Solder Mask Type:LPSM
    CONTOUR/CUTTINGRouting
    MARKING
    Side of Component LegendTOP
    Colour of Component LegendWhite, IJR-4000 MW300, Taiyo Supplied.
    Manufacturer Name or Logo:Marked on the board in a conductor and leged FREE AREA
    VIAPlated Through Hole(PTH), via tented. Vin in pad under BGA package
    FLAMIBILITY RATINGUL 94-V0 Approval MIN.
    DIMENSION TOLERANCE
    Outline dimension:0.0059" (0.15mm)
    Board plating:0.0030" (0.076mm)
    Drill tolerance:0.002" (0.05mm)
    TEST100% Electrical Test prior shipment
    TYPE OF ARTWORK TO BE SUPPLIEDemail file, Gerber RS-274-X, PCBDOC etc
    SERVICE AREAWorldwide, Globally.


    1.5 Impedance PCB and Impedance Match


    The characteristic impedance of the conductor on the printed circuit board is an important indicator of the circuit design, especially in the PCB design of high frequency circuit. Whether the characteristic impedance of the conductor is consistent and matching with the characteristic impedance required by the device or signal must be taken into consideration. Therefore, these two concepts in reliability design of PCB design must be paid attention.


    There will be a variety of signal transmission in the conductor of circuit board. To increase the rate of transmission, it must increase its frequency. Due to the factors of the circuit itself such as etching, stack thickness, track width and so on are different, it will cause changes of the impedance value, resulting in its signal distortion. Therefore, the impedance value of conductor on high-speed circuit board should be controlled within a certain range, known as the "impedance control". The factors that affect the impedance of the PCB wiring are mainly the width of the copper track, the thickness of the copper track, the dielectric constant of the dielectric, the thickness of the dielectric, the thickness of the pad, the path of the ground layer, the wires around the wiring, etc. So the impedance of the wiring on the board must be controlled in the design of the PCB to avoid signal reflection and other electromagnetic interference and signal integrity issues as far as possible, to guarantee the stability of the actual use of the PCB board. You can refer to the corresponding empirical formula for the calculation method of micro-strip line and strip line impedance on PCB board.


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