Categories | PCB Assembly |
---|---|
Brand Name: | Found |
Model Number: | FD-036 |
Certification: | UL E361831 |
Place of Origin: | China |
MOQ: | 1 PC |
Price: | negotiable |
Payment Terms: | T/T |
Supply Ability: | 10 000 |
Delivery Time: | 5-8 work days |
Packaging Details: | Vacuum Packing |
Base material: | Aluminum |
Product name: | Printed Circuit Board |
Type: | Electronic Board,printing circuit board |
Application: | Consumer Electronics,Industry/Medical/Consumer electronic |
Item: | pcb assembly |
Plugging vias capability: | 0.2-0.8mm |
Base Material:FR-4
Copper Thickness:1oz
Board Thickness:0.2-4.0mm
Min. Hole Size:4mil
Min. Line Width&Space:0.08mm
Surface Finishing:HASL
Type:shenzhen pcb manufacturer
PCB layers:1-20 layers
Max Panel size:500*1200mm
Board finished thickness:0.2-4.0mm
Impedance control and tolerance:50±10%
Standard:IPC-A-610D
Service type:One-stop turnkey service
Items | Speci. | |
Max panel size | 32" x 20.5"(800mm x 520mm) | |
Min trace width/ space (inner layer) | 4mil/4mil(0.1mm/0.1mm) | |
Min PAD (inner layer) | 5 mil(0.13mm) | |
Min thickness(inner layer) | 4 mil(0.1mm) | |
Inner copper thickness | 1~4 oz | |
Outer copper thickness | 0.5~6 oz | |
Finished board thickness | 0.4-3.2 mm | |
Board thickness tolerance control | ±0.10 mm | ±0.10 mm |
±10% | ±10% | |
±10% | ±10% | |
Inner layer treatment | brown oxidation | |
Layer count Capability | 1-30 LAYER | |
alignment between ML | ±2mil | |
Min drilling | 0.15 mm | |
Min finished hole | 0.1 mm | |
Hole precision | ±2 mil(±50 um) | |
tolerance for Slot | ±3 mil(±75 um) | |
tolerance for PTH | ±3 mil(±75um) | |
tolerance for NPTH | ±2mil(±50um) | |
Max Aspect Ratio for PTH | 8:1 | |
Hole wall copper thickness | 15-50um | |
Alignment of outer layers | 4mil/4mil | |
Min trace width/space for outer layer | 4mil/4mil | |
Tolerance of Etching | +/-10% | |
Thickness of solder mask | on trace | 0.4-1.2mil(10-30um) |
at trace corner | ≥0.2mil(5um) | |
On base material | ≤+1.2mil Finished thickness | |
Hardness of solder mask | 6H | |
Alignment of solder mask film | ±2mil(+/-50um) | |
Min width of solder mask bridge | 4mil(100um) | |
Max hole with solder plug | 0.5mm | |
Surface finish | HAL (Lead or Lead free), immersion Gold, Immersion Nickel, Electric Gold finger, Electric Gold, OSP, Immersion Silver. | |
Max Nickel thickness for Gold finger | 280u"(7um) | |
Max gold thickness for Gold finger | 30u"(0.75um) | |
Nickel thickness in Immersion Gold | 120u"/240u"(3um/6um) | |
Gold thickness in Immersion Gold | 2u"/6u"(0.05um/0.15um) | |
Impedance control and its tolerance | 50±10%,75±10%,100±10% 110±10% | |
Trace Anti-stripped strength | ≥61B/in(≥107g/mm) | |
bow and twist | 0.75% |
SHENZHEN FOUND PRINTED CIRCUIT BOARD CO.,LTD
Our company has high quality raw materials, rigorous manufacturing process, strict quality control system, fast delivery. Please trust our company's service.
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