Sign In | Join Free | My benadorassociates.com
benadorassociates.com
Products
Search by Category
Home > Quartz Rods >

Borosilicate Lid Glass Wafer With Ultra Thin Thickness For Fiber Optic AWG Application

Categories Glass Wafer
Brand Name: PAM-XIAMEN
Place of Origin: China
MOQ: 1-10,000pcs
Price: By Case
Payment Terms: T/T
Supply Ability: 10,000 wafers/month
Delivery Time: 20-25 working days
  • Haven't found right suppliers
  • Our buyer assistants can help you find the most suitable, 100% reliable suppliers from China.
  • And this service is free of charge.
  • we have buyer assistants who speak English, French, Spanish......and we are ready to help you anytime!
  • Submit Buying Request
    • Product Details
    • Company Profile

    Borosilicate Lid Glass Wafer With Ultra Thin Thickness For Fiber Optic AWG Application

    Borosilicate Lid glass wafer with ultra thin thickness for fiber optic AWG application


    Glass Wafer

    We are one of the world’s leading glass wafer suppliers, provide thin & ultra-thin glass wafers and substrates which are made of different materials, such as Borofloat, Fused Silica & Quartz, BK7, Soda Lime etc for MEMS, fiber optic AWG, LCD panels and OLED substrates application. These wafers are all SEMI Standards including dimensional, flat and notch specifications, also we offer custom specifications designed to your unique needs including alignment marks, holes, pockets, edge profile, thickness, flatness, surface quality, cleanliness or any other details critical to your application, including semiconductor, medical science, communications, lasers, infrared, electronics, measuring instruments, military, and aerospace.

    ParameterMeasurement
    Diameter2″, 4″, 6″, 8″, 10″
    Dimensional Tolerance±0.02μm
    Thickness0.12mm, 0.13mm, 0.2mm, 0.25mm, 0.45mm
    Thickness Tolerance±10μm
    Thickness Variation (TTV)< 0.01mm
    Flatness1/10 Wave/Inch
    Surface Roughness (RMS)<1.5nm
    Scratch and Dig5/2
    Particle Size<5μm
    Bow/Warp<10μm
    For the customized dimension, please contact us

    Glass Wafer Process

    Wafer Cutting: blank wafer are ready through that thick sheets are water jetted and blocks are wire sawn

    Ground Edge: the wafer edge is cylindrical grounded on the Edge Grinding Station.

    Wafer Lapping: the wafer is lapped to appointed thickness.

    Wafer Polishing: Polishing the wafer gives it the mirrored, super-flat surface required for the fabrication.

    Wafer Cleaning: it is the removal of chemical and particle impurities without altering or damaging the wafer surface or substrate on multiple cleaning lines.

    Wafer Inspection: inspect to various quality levels under the appropriate lighting condition in the Class 100 Clean Room.

    Wafer Packaging: All wafers are packed in the single wafer containers.

    Buy Borosilicate Lid Glass Wafer With Ultra Thin Thickness For Fiber Optic AWG Application at wholesale prices
    Send your message to this supplier
     
    *From:
    *To: XIAMEN POWERWAY ADVANCED MATERIAL CO., LTD.
    *Subject:
    *Message:
    Characters Remaining: (0/3000)
     
    Inquiry Cart 0