Automatic ACF Pre-attachment Machine equipment for electronic parts
and components 1.About the application field of ACF Pre-attachment
Machine equipment XCF50-A2. ACF Pre-attachment Machine equipment
XCF50-A2 is mainly used in the process COG driver IC and LCD GLASS
poor bonding after heavy maintenance cleaning. Such as. LCD TV, LCD
monitors, notebook computers, LCD, LCM manufacturers and so on.
2.About the basic parameters of ACF Pre-attachment Machine
equipment XCF50-A2. 2.1Device Power. AC220V 50-60Hz 2.2 Device
Color. rack surface after paint handling, color is “sunsom" color
2.3 Weight. to prevail in kind 2.4 Dimensions. L450 * W400 * H360mm
2.5 Heating. heating thermostat 3、About the functions and
characteristics of ACF Pre-attachment Machine equipment XCF50-A2.
3.1 is simple to operate, compact device 3.2 Time Setting flexible
3.3 Temperature control convenience 3.4 Cleaning shorter
Shenzhen Sunsom automatic equipment Co.,Ltd .
Shenzhen Sunsom automatic equipment Co.,Ltd .
is a high-tech enterprise specialized in R&D,manufacturing and
sales of LCD automatic equipment.we stick to the the enterprise
spirit of " efficiency and practicality",have successfully
developed，
Constant Heat Bonding Machine,Pulse Heat Bonding Machine ,ACF
Taking Machine,automation bubble-removing Machine,Polarizer
Delaminator,HSC Bonding Machine ,large size TFT Bonding Machine
,PDP Bonding Machine,COG Alignment Machine,COG Bonding Machine,COG
Previous Testor,COG Final Testor,ITO Tester,Opencell Testor and
etc.These machines are widely applied to flat panel TFT/LCD
.PDA,PDA;soldering of FPC and FFC to PCB ;polarizer
removing,polarizer laminating,ACF laminating,polarizer claving
process as well as various flat panel displays bonding and
connecting process.
