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Pink 3.0W/MK CPU Heatsink Colling Thermal Conductive Ultra Soft Gap Filler Pad Hardness 35 Shore00

Categories Thermal Conductive Pad
Brand Name: ZIITEK
Model Number: TIF100-30-25E
Certification: UL and RoHs
Place of Origin: China
MOQ: 1000pcs
Price: Negotiation
Supply Ability: 100000pcs/day
Delivery Time: 3-5 days
Packaging Details: 1000pcs/bag
Payment Terms: TT
Products name: Pink 3.0W/MK CPU Heatsink Colling Thermal Conductive Ultra Soft gap filler pad Hardness 35 Shore00
Thermal conductivity: 3.0W/m-K
Hardness: 35/65 Shore 00
Density(g/cm³): 3.0
Dielectric Constant @1MHz: 7.0 MHz
Fire rating: 94-V0
Keywords: thermal gap filler pad
Application: AI Processors CPU Heatsink Colling
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  • Product Details
  • Company Profile

Pink 3.0W/MK CPU Heatsink Colling Thermal Conductive Ultra Soft Gap Filler Pad Hardness 35 Shore00

Company pfofile


Ziitek company is a high-tech enterprise which dedicated to the R&D, manufacture and sales of the thermal interface materials (TIMs). We have rich experiences in this field which can support you the latest, most effective and one -step thermal management solutions. We have many advanced production equipments,full test equipments and fully automatic coating production lines which can support the production for high performance thermal silicone pad, thermal graphite sheet/ film, thermal double-sided tape, thermal insulation pad, thermal ceramic pad, phase change material, thermal grease etc. UL94 V-0, SGS and ROHS are compliant.


The TIF®100-30-25E Series use a special process, with silicone as the base material, adding thermal conductive powder and flame retardant together to make the mixture to become thermal interface material. This is effective in lower the thermal resistance between the heat source and the heat sink.


Features:


> Moldability for complex parts 3.0W/mK
> Outstanding thermal performance
> High tack surface reduces contact resistance
> RoHS compliant
> UL recognized


Applications:


> Telecommunication hardware
> Handheld portable electronics
> Semiconductor automated test equipment (ATE)
> CPU
> Display card
> Mainboard/mother board
> Notebook
> Power supply
> Heat pipe thermal solutions


Typical Properties of TIF®100-30-25E Series
PropertyValueTest method
ColorPinkVisual
Construction & CompostionCeramic filled silicone elastomer******
Density(g/cm³)3.0ASTM D792
Thickness Range(inch/mm)0.010~0.0200.030~0.200ASTM D374
(0.25~0.50)(0.75~5.0)
Hardness65 Shore 0035 Shore 00ASTM 2240
Recommended Operating Temperature-40 to 200℃******
Breakdown Voltage(V/mm)≥5500ASTM D149
Dielectric Constant7.0 MHzASTM D150
Volume Resistivity>1.0X1012 Ohm-meterASTM D257
Flame ratingV-0UL 94 (E331100)
Thermal conductivity3.0 W/m-KASTM D5470
3.0 W/m-KISO22007
Product Specifications

Standard Thickness: 0.010" (0.25 mm)~0.200" (5.00 mm) with increments of 0.010" (0.25 mm)
Standard Size: 16"X 16" (406 mmX406 mm)

Component Codes:
Reinforcement Fabric: FG (Fiberglass).
Coating Options: NS1 (Non-adhesive treatment),
DC1 (Single-sided hardening).
Adhesive Options: A1/A2 (Single-sided/Double-sided adhesive).

The TIF® series is available in custom shapes and various forms.
For other thicknesses or more information, please contact us.

Packaging Details & Lead time


The packaging of thermal pad

1.with PET film or foam-for protection

2. use Paper Card To Separate Each Layer

3. export carton inside and outside

4. meet with customers' requirement-customized


Lead Time :Quantity(Pieces):5000

Est. Time(days): To be negotiated


Ziitek Culture


Quality :

Do it right the first time, total quality control

Effectiveness:

Work precisely and thoroughly for effectiveness

Service:

Quick response, On time delivery and Excellent service

Team work:

Complete teamwork, including sales team, Marketing team, engineering team, R&D team, Manufacturing team, logistics team. All is for supporting and servicing a satisfy service for customers.

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