Multi-layer HF Rogers PCB Sufficient Material for Automotive Device 1OZ Double Layer PCB

Multi-layer HF Rogers PCB Sufficient Material In Automotive Device Application

Specification

• 2 layer
• Green solder mask,
• white silk screen
• Model:XCER
• Size: 15*9cm
• Location: Shenzhen
• Board thickness: 0.2mm
• Copper thickness: 1OZ

Laminates:

• High Tg, BT resins
• Low Dk, Low Df Formulations
• High Strength, Low CTE selections
• Polyimide/Kapton
• Multi-function FR-4
• Min Cladding 1 oz
• Max Cladding 2 oz
• Min Thickness .03mm (.0012)

Parameter

Advantage:

Newest PCB machine and top technology,professional engineer team

Shorter PCB manufacturing lead times and improved device performance for Flip Chip, BGA, MCM, SIP technologies and medical devices.

Accept utilization of technologies that require ultra thin cores, fine line geometries and alternative via technologies for enhanced thermal transfer in the case of a thermal PCB.

Utilization of the technologies that require 20um circuit geometries, 30um dielectric layers, 50um laser vias and 125um bump pitch processing.

Xinchenger Electronics co.,Ltd established in 2009,we have committed ourselves to manufacturing various of printed circuit boards.

We have accumulated abundant experiences in the line of high frequency microwave business for which widely apply to power divider,combiner,power amplifier,line amplifier,base station,RF antena,4G antena so on and so forth. Our company's sufficient stocks of hi-frequency pcb materials such as Rogers,TACONIC,Arlon,Isola,F4B,TP-2,FR-4 (dielectric rage:2.2-16) mainly used in the area of high technologies like communication device,Electronics,Aerospace,Military industry to meet our worldwide customers with high quality. Furthermore,we also keen on helping customers shorten the period of production development and 24 hours of sample service is available.

Since the day of company foundation we continuously engaged in researching special and high precision printed circuit boards with the strong production capability of 2 to 28 layers of highly precise impedence,multi-layer blind buried,multi-layer mix-compression,high TG, copper substrate,Ceramic substrate PCB. We emphasize the significance of traning program for every single staff in the company even grass-roots employees which becomes the most competitive factors to excel from others,our company have many experienced and professional teams from management to production line,30% are highly educated among the total amount of employees,advanced engineers and senior technicians are up to 80 people.

With advanced foreign technology supports and domestic 3G/4G device manufacturer in microwave pcb field which lead our experienced hi-frequency researching team to one step ahead of the line of printed circuit board business,we are honored to obtain sound reputations over our worldwide customers on the basis of fine qulity,prompt delivery,satisfied after sales service for may years and we assure our customers that we will return the favors with more and more superior products in the near future.