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| Categories | RJ45 Modular Jack | 
|---|---|
| Brand Name: | LINK-PP | 
| Model Number: | 1840028-1 | 
| Certification: | UL,RoHS,Reach,ISO | 
| Place of Origin: | GuangDong, China | 
| MOQ: | 50/500/1000/60K | 
| Price: | $0.11-$24 | 
| Payment Terms: | TT,NET30/60/90 Days | 
| Supply Ability: | 180K/Month | 
| Delivery Time: | Stock | 
| Packaging Details: | Tray | 
| Part Number: | 1840028-1 / 1840026-1 | 
| Number of Ports: | 1X1 and 2 USB A | 
| Connector Type: | Rj45 USB Connector Combo | 
| Applications: | 10/100BASE-T | 
| Mounting Type: | Through Hole Mount | 
| Orientation: | 90~ Angle (Right) | 
| Termination: | Solder | 
| EMI Tabs: | Shielded with EMI Finger | 
| Company Info. | 
| LINK-PP INT'L TECHNOLOGY CO., LIMITED | 
| Verified Supplier | 
| View Contact Details | 
| Product List | 
| Category | Specification | 
|---|---|
| Number of Ports | 1×1 RJ45 + 2× USB A | 
| Ethernet Speed | 10/100BASE-T | 
| Impedance | 100 Ω | 
| Turns Ratio (Chip: Cable) | TX = 1:1, RX = 1:1 | 
| Open Circuit Inductance (OCL) | 350 µH Min @ 100 kHz, 0.1 Vrms, 8 mA DC Bias (0°C to 70°C) | 
| Insertion Loss (IL) | 1.1 dB Max from 0.5 MHz to 100 MHz | 
| Return Loss (RL) | ≥ 18 dB from 0.5 MHz to 30 MHz ≥ [18–20·log(f/30)] dB from 30.1 MHz to 60 MHz ≥ 12 dB from 60.1 MHz to 80 MHz | 
| Crosstalk Attenuation | ≥ 35 dB from 5 MHz to 40 MHz ≥ [33–20·log(f/50)] dB from 40.1 MHz to 100 MHz | 
| Common Mode Rejection (CMRR) | ≥ 30 dB from 0.5 MHz to 100 MHz | 
| Isolation Voltage | Meets IEEE 802.3 Standard | 
| Port Configuration | Tab Up RJ45 with USB | 
| Height Profile | Standard | 
| LED Indicator | Yes (Green/Orange) | 
| EMI Tabs | Yes | 
| Mounting Type | Through-Hole | 
| Operating Temperature | 0°C to +70°C | 
| RoHS Compliance | Yes | 
Material: Phosphor Bronze, 0.30 mm Thickness
Plating: 1.27 μm Min. Overall Nickel Underplate
Mating Area: Selective Gold Plating (thickness per specification)
Solder Tails: 2.54 μm Min. Matte Tin and/or SAC Solder
2.03 μm Min. Silver over
1.02 μm Min. Nickel underplate over
1.02 μm Copper base
Post-Dipped with: 2.54 μm Min. Matte Tin and/or SAC Solder or Pure Tin
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