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| Categories | Impedance Controlled PCB |
|---|---|
| Brand Name: | Bicheng Enterprise Limited |
| Model Number: | BIC-0818-V8.18 |
| Certification: | UL |
| Place of Origin: | China |
| MOQ: | 1 |
| Price: | USD78~110 |
| Payment Terms: | T/T , Paypal |
| Supply Ability: | 45000 pieces per month |
| Delivery Time: | 2-3 working days |
| Packaging Details: | KK carton (hard card) |
| Base material: | Stainless steel shim |
| Structure: | Stencil foils with aluminum frame |
| Foil Thickness: | 0.12mm |
| Aperture configured: | Laser cut |
| Appearance: | Engraving and electro polishing |
| Fiducial mark: | Through hole |
| Application:: | CSP, BGA, 0.5mm QFP etc. package |
Product profile
1.1 General description
This is a type of laser cut SMT stencil built on 0.12mm stainless
steel foil with 598 mm
x 598 mm length and width. It’s fabricated per IPC 7525A using supplied Gerber data,
squeegee area locating in the center. 4 sides of edges are through holes to suit for the
SMT machine. It’s packed with KK carton (hard card) and usually 2 stencils are packed
for shipment.
1.2 Features and benifits
A. The data file is used directly to produce and reduce the error
rate;
B. The opening position accuracy of SMT template is very high: the
whole process error
is ≤ ±4 μ m;
C. The opening of SMT template has geometric figure, which is
advantageous to the
printing and forming of tin paste;
D. ISO9000 certified manufacturing factory;
E. 12 hours quotation;
F. Quick Lead time: 1-2 days;
G. No MOQ, low cost for prototypes and small runs quantity;
1.3 Application
SMD package such as PLCC,QFP,0402,0201,BGA,Flip Chip.
1.4 Parameter and data sheet
| Dimension: | 598 x 598 mm =1 PCS |
| Structure | Stencil foils with aluminum frame |
| Base material | Stainless steel shim |
| Foil Thickness | 0.12mm |
| Aperture configured | Laser cut |
| Appearance | Engraving and electro polishing |
| Fiducial mark | Through hole |
| Service area: | Worldwide |
| Quantity of open pads: | 166 |
| Advantages: | a) High precision dimension; b) Good shape on the window; c) Hole wall is smoother. |
| Application: | CSP, BGA, 0.5mm QFP etc. package |
1.5 Opening Hole Design for Stencil
| Component Type | Pitch | Soldering Width | Soldering Length | Opening Width | Opening Length | Shim Thickness |
| PLCC | 1.27mm | 0.65mm | 2.00mm | 0.60mm | 1.95mm | 0.15-0.25mm |
| QFP | 0.635mm | 0.35mm | 1.50mm | 0.32mm | 1.45mm | 0.15-0.18mm |
| QFP | 0.50mm | 0.254-0.33mm | 1.25mm | 0.22-0.25mm | 1.20mm | 0.12-0.15mm |
| QFP | 0.40mm | 0.25mm | 1.25mm | 0.20mm | 1.20mm | 0.10-0.12mm |
| QFP | 0.30mm | 0.20mm | 1.00mm | 0.15mm | 0.95mm | 0.07-0.12mm |
| 0402 | 0.50mm | 0.65mm | 0.45mm | 0.60mm | 0.12-0.15mm | |
| 0201 | 0.25mm | 0.40mm | 0.23mm | 0.35mm | 0.07-0.12mm | |
| BGA | 1.27mm | 0.80mm | 0.75mm | 0.75mm | 0.15-0.20mm | |
| BGA | 1.00mm | 0.38mm | 0.35mm | 0.35mm | 0.10-0.12mm | |
| BGA | 0.50mm | 0.30mm | 0.28mm | 0.28mm | 0.07-0.12mm | |
| Flip Chip | 0.25mm | 0.12mm | 0.12mm | 0.12mm | 0.12mm | 0.08-0.10mm |
| Flip Chip | 0.20mm | 0.10mm | 0.10mm | 0.10mm | 0.10mm | 0.05-0.10mm |


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