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| Categories | Arlon PCB Board |
|---|---|
| Brand Name: | Bicheng Technologies Limited |
| Model Number: | BIC-146-V6.29 |
| Certification: | UL |
| Place of Origin: | China |
| MOQ: | 1 |
| Price: | USD20~30 |
| Payment Terms: | T/T, Paypal |
| Supply Ability: | 45000 pieces per month |
| Delivery Time: | 4-5 working days |
| Packaging Details: | Vacuum |
| Glass Epoxy: | RF-60A |
| Final height of PCB: | 1.6 mm ±0.1 |
| Final foil external: | 1.0 oz |
| Surface Finish: | Immersion silver |
| Solder Mask Color: | no |
| Colour of Component Legend: | no |
| TEST: | 100% Electrical Test prior shipment |
Taconic RF-60A 60mil 1.5mm High Frequency PCB With Immersion Silver For Power Amplifiers
(Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)
RF-60A is an organic-ceramic laminate in the ORganic CERamic(ORCER) family of Taconic products. It's based on woven glass reinforcement. It is a result of Taconic's expertise in both ceramic fill technology and in coated PTFE fiberglass. RF-60A exhibits exceptional interlaminar bond strength and solder resistance. Its proprietary composition results in low moisture absorption and uniform electrical properties.
RF-60A's woven glass reinforcement ensures excellent dimensional stability and enhances flexural strength. It exhibits low Z-axis expansion allowing for plated-through-hole reliablity in extreme thermal environments. With a dielectric constant of approximately 6.15, it is ideal high DK products for applications requiring reduced circuit size and weight. The low electrical loss factor makes it an excellent selection for RF circuits.
RF-60A laminates are in complete compliance with RoHS and WEEE directives and are compatible with the temperatures required for the new lead free solders. They can be sheared, drilled, milled and plated using standard methods for PTFE-woven fiberglass materials, so mass production becomes possible.
Our PCB Capabilities (RF-60A)
| PCB Material: | Organic-ceramic Woven Fiberglass Reinforced Laminates |
| Designation: | RF-60A |
| Dielectric constant: | 6.15 ±0.25 |
| Dissipation Factor | DF 0.0038@10 GHz |
| Thermal Conductivity | 0.4 W/MK |
| Layer count: | Double Layer, Multilayer, Hybrid PCB |
| Copper weight: | 0.5oz (17 µm), 1oz (35µm), 2oz (70µm) |
| PCB thickness: | 10mil (0.254mm), 25mil (0.635mm), 31mil (0.787mm), 50mil (1.27mm), 60mil (1.524mm), 125mil (3.175mm) |
| PCB size: | ≤400mm X 500mm |
| Solder mask: | Green, Black, Blue, Yellow, Red etc. |
| Surface finish: | Bare copper, HASL, ENIG, OSP, Immersion tin etc.. |
Benefits (in general):
Low Moisture Absorption
Stable DK over Frequency
Dimensionally Stable
Low Z-axis Expansion
High Flexural Strength
Exceptional Interlaminar Bonds
Typical Applications:
Power Amplifiers
Filters & Couplers
Passive Components
Antennas
Data Sheet of Taconic RF-60A
| Property | Test Method | Unit | Value | Unit | Value |
| Dk @ 10 GHz | IPC-650 2.5.5.6 | 6.15 | 6.15 | ||
| Df @ 10 GHz | IPC-650 2.5.5.5.1 | 0.0038 | 0.0038 | ||
| Moisture Absorption | IPC-650 2.6.2.1 | % | 0.02 | % | 0.02 |
| Dielectric Breakdown | IPC-650 2.5.6 | kV | 53 | kV | 53 |
| Dielectric Strength | ASTM D 149 | V/mil | 880 | kV/mm | 35 |
| Volume Resistivity | IPC-650 2.5.17.1 (After Humidity) | Mohm/cm | 9.0 x 108 | Mohm/cm | 9.0 x 108 |
| Surface Resistivity | IPC-650 2.5.17.1 (After Humidity) | Mohm | 2.28 x 108 | Mohm | 2.28 x 108 |
| Arc Resistance | IPC-650 2.5.1 | Seconds | 193 | Seconds | 193 |
| Flexural Strength (MD) | ASTM D 790 | psi | 18,300 | N/mm2 | 126.2 |
| Flexural Strength (CD) | ASTM D 790 | psi | 14,600 | N/mm2 | 100.7 |
| Tensile Strength (MD) | ASTM D 3039 | psi | 19,500 | N/mm2 | 134.4 |
| Tensile Strength (CD) | ASTM D 3039 | psi | 16,300 | N/mm2 | 112.4 |
| Young’s Modulus | ASTM D 3039 | kpsi | 1,590 | N/mm2 | 11,000 |
| Poisson’s Ratio | ASTM D 3039 | 0.068 | N/mm2 | 0.068 | |
| Compressive Modulus | ASTM D 695 (23°C) | kpsi | 338 | 2,330 | |
| Peel Strength (1 oz. ED) | IPC-650 2.4.8 Sec. 5.2.2 (Thermal Stress) | lbs/in | 8 | N/mm | 1.4 |
| Dimensional Stability (MD) | IPC-650 2.4.39 Sec. 5.4 (After Bake) | mils/in | 0.68 | mm/M | 0.68 |
| Dimensional Stability (CD) | IPC-650 2.4.39 Sec. 5.4 (After Bake) | mils/in | 1.05 | mm/M | 1.05 |
| Density (Specific Gravity) | ASTM D 792 | g/cm3 | 2.79 | g/cm3 | 2.79 |
| Thermal Conductivity | ASTM F 433 | W/M*K | 0.4 | W/M*K | 0.4 |
| CTE (X axis) | ASTM D 3386 (-30°C - 125°C) | ppm/°C | 9 | ppm/°C | 9 |
| CTE (Y axis) | ASTM D 3386 (-30°C - 125°C) | ppm/°C | 8 | ppm/°C | 8 |
| CTE (Z axis) | ASTM D 3386 (-30°C - 125°C) | ppm/°C | 69 | ppm/°C | 69 |
| Outgassing (% TML) | ASTM E 595* | % | 0.02 | % | 0.02 |
| Outgassing (% CVCM) | ASTM E 595* | % | 0.00 | % | 0.00 |
| Outgassing (% WVR) | ASTM E 595* | % | 0.01 | % | 0.01 |
| Flammability Rating | UL 94 | V-0 | V-0 |
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