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Low Expansion Copper Tungsten Alloy Heat Sink ISO / RoHs Approval

Categories Copper Tungsten Alloy
Brand Name: TY
Model Number: At customer's requested
Certification: ISO, RoHs
Place of Origin: China
MOQ: 5 kgs
Price: 1-100usd
Payment Terms: T/T, Western Union,paypal
Supply Ability: 5 tons per month
Delivery Time: 3-35 days
Packaging Details: wooden case
Materia: WCu
Product Standard: ASTM B 702
Class: W50/Cu50 - W90/Cu10
Density: 11.85 - 16.75
Brand: TY
Application: microelectronic components
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Low Expansion Copper Tungsten Alloy Heat Sink ISO / RoHs Approval

WCu Copper Tungsten AlloyTungsten Copper Heat Sink with 10-50 wt.% Cu


Description:


Tungsten copper heat sink is used for transferring heat generated in microelectronic components to prevent thermal damage.

Tungsten copper heat sink is a composite of tungsten and copper, so both the thermal advantages of copper and the very low expansion characteristics of tungsten can be adjusted to meet different requirements.


Application:


They are extensively used as thermal mounting plates, chip carriers, tungsten copper flanges, and frames for RF, light emitting diodes and detectors, laser diode packages like pulse, single emitter, bars and complex carriers for optoelectronics amplifiers, receivers, transmitters, tunable lasers, etc.


Advantages:


1. High thermal conductivity

2. Excellent hermeticity

3. Excellent flatness, surface finish, and size control


Product Properties:


GradeW ContentDensity g/cm3

Coefficient of thermal

Expansion ×10-6 (20℃)

Thermal conductivity W/(M·K)
90WCu90±2%17.06.5180 (25℃) /176 (100℃)
85WCu85±2%16.47.2190 (25℃) / 183 (100℃)
80WCu80±2%15.658.3200 (25℃) / 197 (100℃)
75WCu75±2%14.99.0230 (25℃) / 220 (100℃)
50WCu50±2%12.212.5340 (25℃) / 310 (100℃)

Product Tags:

tungsten heavy alloy

  

tungsten alloy

  
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