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| Categories | Thermal Gap Filler |
|---|---|
| Brand Name: | ZIITEK |
| Model Number: | TIF800QE |
| Certification: | UL RoHs |
| Place of Origin: | China |
| MOQ: | 1000pcs |
| Price: | negotiation |
| Supply Ability: | 100000pcs/day |
| Delivery Time: | 3-5work days |
| Packaging Details: | 1000pcs/bag |
| Products name: | 13.0W/MK Ultra Soft Thermal Gap Filler Wireless Routers Heatsink Thermal Pad |
| Thermal conductivity: | 13.0W/mK |
| Application: | Wireless router |
| Dielectric Breakdown Voltage: | >5500 (V/mm) |
| Feature: | Available in different thickness options |
| Keywords: | Thermal Gap Filler |
| Hardness: | 35 Shore 00 |
| Company Info. |
| Dongguan Ziitek Electronic Materials & Technology Ltd. |
| Verified Supplier |
| View Contact Details |
| Product List |
13.0W/MK Ultra Soft Thermal Gap Filler Wireless Routers Heatsink
Thermal Pad
The TIF800QE series of thermal interface materials is specifically designed to
fill air gaps between heat-generating components and heat sinks or
metal baseplates. It ofers excellent compliance, allowing it to
conform tightly to heat sources with varying shapes and height
differences. Even in confined or irregular spaces,it maintains
stable thermal conductivity,enabling efficient heat transfer from
discrete components or the entire PCB to the metal housing or heat
sink.This significantly improves the heat dissipation eficiency of
electronic lcomponents, thereby enhancing operational stability and
extending device lifespan.
Features:
> Good thermal conductive: 13.0W/mK
> Naturally tacky needing no further adhesive coating
> High compliance adapts to various pressure application
environments
> Available in different thickness options
Applications:
> Heat dissipation structure for radiators
> Telecommunication equipment
> Automotive electronics
> Battery packs for electric vehicles
> LED drivers and lamps
> Handheld portable electronics
> Semiconductor automated test equipment (ATE)
> CPU
> Display card
> Mainboard/mother board
| Typical Properties of TIF®800QE Series | ||
| Color | Gray | Visual |
| Construction | Ceramic filled silicone elastomer | ****** |
| Thickness Range(inch/mm) | 0.03~0.20inch(0.75mm~5.0mm) | ASTM D374 |
| Density(g/cc) | 3.7 g/cc | ASTM D792 |
| Hardness | 35 Shore 00 | ASTM 2240 |
| Recommended Operating Temperature(℃) | -40 to 200℃ | ****** |
| Dielectric Breakdown Voltage | >5500 VAC | ASTM D149 |
| Dielectric Constant @ 1MHz | 8 | ASTM D150 |
| Volume Resistivity | ≥1.0X10¹² Ohm-meter | ASTM D257 |
| Flame rating | V-0 | UL94(E331100) |
| Thermal conductivity | 13.0W/m-K | ASTM D5470 |
Product Specifications
Standard Thickness: 0.02 to 0.20 (0.50 to 5.0mm) with increments of
0.01 (0.25mm).
Standard Size: 16" X 16" (406mm X 406mm).
Component Codes:
Reinforcement Fabric: FG (Fiberglass).
Coating Options:NS1 (Non-adhesive treatment),DC1(Single-sided
hardening).
Adhesive Options: A1/A2 (Single-sided/Double-sided adhesive).
Notes:FG(Fiberglas)provides enhanced strength, suitable for
materials with thicknesses of 0.01 to 0.02 inch (0.25 to 0.5mm).
TheTIF series is available in custom shapes and various forms. For
other thicknesses or more information, please contact us.
Certifications:
ISO9001:2015
ISO14001: 2004 IATF16949:2016
IECQ QC 080000:2017
UL
Company Profile
With a wide range, good quality, reasonable prices and stylish
designs, Ziitek thermal conductive interface materials are extensively used in Mainboards, VGA cards, Notebooks,
DDR&DDR2 products, CD-ROM ,LCD TV, PDP products, Server Power
products, Down lamps, Spotlights, Street lamps, Daylight lamps, LED
Server Power products and others.
FAQ:
Q: Are you trading company or manufacturer ?
A: We are manufacturer in China
Q: How long is your delivery time?
A: Generally it is 3-7 work days if the goods are in stock. or it
is 7-10 work days if the goods are not in stock, it is according to
quantity.
Q: Do you offer free samples ?
A: Yes, we are willing to offer free sample.
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