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| Categories | Back Grinding Wheel |
|---|---|
| Brand Name: | Hongtuo |
| Model Number: | HT-BGW |
| Certification: | ISO9001:2015 |
| Place of Origin: | China (Mainland) |
| MOQ: | 2 |
| Price: | Price can be negotiated |
| Payment Terms: | T/C,T/T |
| Supply Ability: | 300/pcs per month |
| Delivery Time: | 2-3weeks |
| Packaging Details: | Carton Box |
| Name: | Silicon Wafer Back Grinding Wheels |
| Applications: | Semiconductor silicon |
| Space code: | 6A2 or 14A1 |
| Finishing: | Nitride |
| Body: | STEEL |
| Structure: | With flange or without |
Back Grinding Wheel Silicon Wafer Back & Front Rough and Finish Grinding
Hongtuo, as a major designer, manufacturer and distributor of diamond and CBN grinding wheels, can offer an excellent selection of back grinding wheels. This particular grinding tool comes in two types: a silicon wafer back grinding wheel and an LED substrate back grinding wheel. Both of them can be used on different grinding machines made in Europe,America,Japan, and China. They also feature a stable performance and a high cost effectiveness.
Silicon Wafer Back Grinding Wheel
This abrasive wheel is primarily used for thinning and finishing semiconductor wafers. It comes with a superior grinding performance and a low coast. It can be used on grinding machines manufactured in Japan,Germany and China.
Grinding Objects: Discrete devices, IC substrate silicon wafers and original silicon wafers
Processes: Back to front rough and fine grinding
Application: Semiconductor silicon, Wafer Back & Front Rough and Finish Grinding.
Work Piece Materials: Monocrystalline silicon and other semiconductor materials.

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