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2500mm/s Laser Depaneling - A Laser Precision Laser Cutting Solutions for Flexible PCB

Categories PCB Separator For Motorized
Brand Name: SMTfly
Model Number: CWVC-5L
Certification: CE
Place of Origin: China
MOQ: 1Set
Price: USD
Supply Ability: 30/Year
Delivery Time: 30 Working days after payment
Packaging Details: Wooden case
PCB Material: Aluminum,Fiber,Flexible PCB
Laser Power: Optional
Working Field: Customizable
Position: CCD Camera
Laser Source: Optional
Weight: 1500KG
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2500mm/s Laser Depaneling - A Laser Precision Laser Cutting Solutions for Flexible PCB

2500mm/s Laser Depaneling - A Laser Precision Laser Cutting Solutions for Flexible PCB Parameters:


LaserQ-Switched diode-pumped all solid-state UV laser
Laser Wavelength355nm
Laser Power10W/12W/15W/17W@30KHz
Positioning Precision of Worktable of Linear Motor±2μm
Repetition Precision of Worktable of Linear Motor±1μm
Effective Working Field460mmX460mm(Customizable)
Laser Scanning Speed2500mm/s (max)
Galvanometer Working Field Per One Process

40mmх40mm


2500mm/s Laser Depaneling - A Laser Precision Laser Cutting Solutions for Flexible PCB


1. Description


Neat and smooth edge, no burr or overflow

Wide application range, including FPC exterior cutting, profile cutting, drilling, opening window for covering, etc.

Laser wavelength: 355nm

Rated power: 10W/12W/15W/18W@30KHz

Galvanometer working field Per One Process: 40 × 40mm

Power consumption for the hole machine: 2KW


2. Features


More quick and easy, shorten the delivery time;

High quality ,no distortion,surface clean& uniformity;

Gathering the CNC tech,laser tech,software tech…High accuracy,High speed;


3. Cutting Application


FPC and some relative materials;

FPC/PCB/ Rigid-Flex PCB cutting, Camera module cutting;


500mm/s Laser Depaneling - A Laser Precision Laser Cutting Solutions for Flexible PCB Description:


PCB depaneling (singulation) laser machines and systems have been gaining popularity over recent years. Mechanical depanaling/singulation is done with routing, die cutting, and dicing saw methods. However, as the boards get smaller, thinner, flexible, and more sophisticated, those methods produce even more exaggerated mechanical stress to the parts. Large boards with heavy substrates absorb these stresses better, while these methods used on ever-shrinking and complex boards can result in breakage. This brings lower throughput, along with the added costs of tooling and waste removal associated with mechanical methods.

Increasingly, flexible circuits are found in the PCB industry, and they also present challenges to the old methods. Delicate systems reside on these boards and non-laser methods struggle to cut them without damaging the sensitive circuitry. A non-contact depaneling method is required and lasers provide a highly precise way of singulation without any risk of harming them, regardless of substrate.


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