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| Categories | Fr4 PCB |
|---|---|
| Brand Name: | XCE |
| Model Number: | XCEM |
| Certification: | CE,ROHS, FCC,ISO9008,SGS,UL |
| Place of Origin: | China |
| MOQ: | 1pcs |
| Price: | negotiation |
| Payment Terms: | T/T,Western union |
| Supply Ability: | 1, 000, 000 PCS / week |
| Delivery Time: | 5-10 days |
| Packaging Details: | inner: vacuum-packed bubble bag outer: carton box |
| Material: | FR4 |
| Layer: | 6 |
| Color: | Green |
| Min line space: | 4mil |
| Min line width: | 4mil |
| Copper thickness: | 1OZ |
| Board size: | 88*68MM |
| Panel: | 1 |
| Surface: | Immersion Gold |
Electrical 6 Layer PCB Printed Circuit Board for Equipments Impedance Control Green Solder PCB
Description:
We are a profesional FR4 PCB Circuit Board manufacturer in China, and we can offer a various of single sided to multilayer PCB to you.
F (for flame) and R (for retardancies) and the 4 is a 4 epoxy.FR4 is a glass fiber epoxy laminate.FR4 is the Main material for PCB manufacture, it is the excellent quality and reasonable price material
FR-4 is widely used for single and multilayer boards, which has excellent thermal tolerance as much as 130°C. Now this type material FR-4 is more widely manufactured, but the hence is less costly.
specification:
layer: multilayer
material: fr4
Tg value: tg135-tg180
board thickness:1.6mm
copper thickness:.1.5oz
surface treatment:Hasl lead free+gold finger
About us:
With 900workers,full-process equippted(including
lamination.imersion Gold),we make 1~24layers board in guaranteed
quality.
Special Advantage: High frequency board-rogers,ITEQ,board thickness
0.2~7.0mm,copper thickness 1/3~8oz are available )
Parameter:
| Product name | FR4 PCB | Double side | 4 layer | 6 layer | 8 layer | 10-28layer |
| layer | Single side | Double side | 4 layer | 6 layer | 8 layer | 10-28layer |
| Base Maerial | FR4 | FR4,Alu,polymide | FR4 | FR4 | FR4 | FR4 |
| Copper thickness | 1-6OZ | |||||
| Min.Hole size | 0.1mm | |||||
| Min.Line Width | 0.1mm | |||||
| Surface finishing: | HASL / HASL lead free, HAL, Chemical tin, Chemical Gold, Immersion Silver/Gold, OSP, Gold plating | |||||
| Solder masker color | green,red,black,white,yellow | |||||
| Silkscreen color | black,white,yellow | |||||
| Tolerance | - Shape tolerance: ±0.13 - Hole tolerance: PTH: ±0.076 NPTH: ±0.05 | |||||
| Special requirements | Buried and blind vias+controlled impedance +BGA | |||||
| Factory Manufacture Capability | ||
| NO | ITEM | Techinical capabilities |
| 1 | Materials | FR-4,Rogers,Taconic,Isola,F4B,Nelco |
| 2 | Material Type | Rogers,Taconic,Isola,F4B,Nelco |
| 3 | Layers | 1-multi Layer |
| 4 | Min. core material | PP |
| 5 | Max. board size | 600mm *1200mm |
| 6 | Copper Thickness | 1-4 OZ |
| 7 | Min. board thickness | 0.5 mm |
| 8 | Max. board thickness | 5.0 mm |
| 9 | Min. line width/space | 0.1mm |
| 10 | Min. Letter line width | 0.15mm |
| 11 | Min. Letter height | 0.8mm |
| 12 | Min. hole size | 0.75mm(NPTH) |
| 13 | Hole dia. tolerance | ±0.05mm |
| 14 | solder Mask | White, Black, Green |
| 15 | Outline Tolerance | ±0.15mm |
| 16 | Modeling | Punching, Routing, V-cutting |
| 17 | Special Hole | Blind hole, Blind slot, T-hole, T-slot, Counter sink hole, Cup hole |
| 18 | Peel Strength | >=1.3N/mm |
| 19 | Thermal Stress | 288ºC, 2min |
| 20 | Thermal Conductivity | >=2.0 W/m-k |
| 21 | Thermal Resistance | ≤0.55 ºC/W |
| 22 | Test Voltage | 5 V |
| 23 | Surface Finish | HAL , OSP , Immersion Gold |
| 24 | File Format | Gerber , DPF, HPGL,CAM,DXP,CADM,PADS |
| 25 | Dielectric Breakdown | >=2.5 KV |
| 26 | Max. Package Size | 1200mm*600 mm |
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