Electro Mechanical PCB Assembly PCBA for Equipment Control Mixed

Electro Mechanical Assembly PCBA for Equipment Control Mixed PCB Assembly
Quick detail:

PCB Assembly Details:
Standard Component Sourcing Service
Supplier →Components Purchase →IQC →Protection Control →Material Supply →Firmware
Technical Requirement for PCB Assembly:
v Professional Surface-mounting and Through-hole soldering Technology
v Various sizes like 1206,0805,0603,0402,0201 components SMT technology
v ICT(In Circuit Test),FCT(Functional Circuit Test) technology.
v PCB Assembly With UL,CE,FCC,Rohs Approval
v Nitrogen gas reflow soldering technology for SMT.
v High Standard SMT&Solder Assembly Line
v High density interconnected board placement technology capacity.
PCB Assembly Manufacturing Procedures:
vProgram Management
PCB Files →DCC →Program Organizing →Optimization →Checking
vSMT Management
PCB Loader →Screen Printer →Checking →SMD Placement →Checking →Air Reflow →Vision Inspection →AOI →Keeping
vPCBA Management
THT→Soldering Wave (Manual Welding) →Vision Inspection →ICT →Flash →FCT →Checking →Package →Shipment

Parameter:

Xinchenger Electronics co.,Ltd established in 2009,we have committed ourselves to manufacturing various of printed circuit boards.

We have accumulated abundant experiences in the line of high frequency microwave business for which widely apply to power divider,combiner,power amplifier,line amplifier,base station,RF antena,4G antena so on and so forth. Our company's sufficient stocks of hi-frequency pcb materials such as Rogers,TACONIC,Arlon,Isola,F4B,TP-2,FR-4 (dielectric rage:2.2-16) mainly used in the area of high technologies like communication device,Electronics,Aerospace,Military industry to meet our worldwide customers with high quality. Furthermore,we also keen on helping customers shorten the period of production development and 24 hours of sample service is available.

Since the day of company foundation we continuously engaged in researching special and high precision printed circuit boards with the strong production capability of 2 to 28 layers of highly precise impedence,multi-layer blind buried,multi-layer mix-compression,high TG, copper substrate,Ceramic substrate PCB. We emphasize the significance of traning program for every single staff in the company even grass-roots employees which becomes the most competitive factors to excel from others,our company have many experienced and professional teams from management to production line,30% are highly educated among the total amount of employees,advanced engineers and senior technicians are up to 80 people.

With advanced foreign technology supports and domestic 3G/4G device manufacturer in microwave pcb field which lead our experienced hi-frequency researching team to one step ahead of the line of printed circuit board business,we are honored to obtain sound reputations over our worldwide customers on the basis of fine qulity,prompt delivery,satisfied after sales service for may years and we assure our customers that we will return the favors with more and more superior products in the near future.