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| Categories | Ceramic Coating Equipment |
|---|---|
| Brand Name: | ROYAL |
| Model Number: | RT1200-DPC |
| Certification: | CE |
| Place of Origin: | Made in China |
| MOQ: | 1 set |
| Price: | negotiable |
| Payment Terms: | L/C, D/A, D/P, T/T |
| Supply Ability: | 6 sets per month |
| Delivery Time: | 12 weeks |
| Packaging Details: | Export standard, to be packed in new cases/cartons, suitable for long-distance ocean/air and inland transportation. |
| Chamber: | Vertical Orientation, 1-door |
| Material: | Stainless Steel 304/316 |
| Deposition Sources: | Magnetron DC / MF Sputtering + Steered Cathodic Arc |
| Deposition Films: | Ni, Cu, Ag, Au, Ti, Zr, Cr etc. |
| Applications: | LED Ceramic Chips with Cooper Plating, Al2O3, AlN ceramic circuit boards, Al2O3 plates on LED, semiconductor |
| Film Features: | wear resistance, strong adhesion, decorative coating colors |
| Factory Location: | Shanghai city, China |
| Worldwide Service: | Poland - Europe; Iran- West Asia & Middle East, Turkey, India, Mexico- South America |
| Training Service: | Machine operation, maintenance, coating process Recipes, program |
| Warranty: | Limited warranty 1 year for free, whole life for machine |
| OEM & ODM: | available, we support tailor made design and fabrication |
| Company Info. |
| SHANGHAI ROYAL TECHNOLOGY INC. |
| Verified Supplier |
| View Contact Details |
| Product List |
Ceramic LED Chips Sputtering Coating Plant / Ag, Cu Deposition on Al2O3 , AlN Circuit Boards
Performance
1. Ultimate Vacuum Pressure: better than 5.0×10-6 Torr.
2. Operating Vacuum Pressure: 1.0×10-4 Torr.
3. Pumpingdown Time: from 1 atm to 1.0×10-4 Torr≤ 3 minutes ( room temperature, dry, clean and empty chamber)
4. Metalizing material (sputtering + Arc evaporation): Ni, Cu, Ag, Au, Ti, Zr, Cr etc.
5. Operating Model: Full Automatically /Semi-Auto/ Manually
Structure
The vacuum coating machine contains key completed system listed below:
1. Vacuum Chamber
2. Rouhging Vacuum Pumping System (Backing Pump Package)
3. High Vacuum Pumping System ( Magnetically Suspension Molecular Pump)
4. Electrical Control and Operation System
5. Auxiliarry Facility System (Sub System)
6. Deposition System
Copper Sputtering Coating Machine Key Features
1. Equipped with 8 steer arc cathodes and DC Sputtering Cathodes, MF Sputtering Cathodes, Ion source unit.
2. Multilayer and co-deposition coating available
3. Ion source for plasma cleaning pre-treatment and Ion-beam assisted deposition to enhance the film adhesion.
4. Ceramic/ Al2O3/AlN substrates heating up unit;
5. Substrate rotation and revolution system, for 1-side coating and 2-sides coating.

Cooper Magnetron Sputtering Coating Plant on Ceramic Radiating Substrate
The DPC process- Direct Plating Copper is an advanced coating technology applied with LED / semiconductor / electronic industries. One typical application is Ceramic Radiating Substrate.
Cooper conductive film deposition on Al2O3, AlN substrates by PVD vacuum sputtering technology, compared with traditional manufacturing methods: DBC LTCC HTCC, much lower production cost is its high feature.
Royal technology team assited our customer to developed the DPC process sucessfully with PVD sputtering technology.
The RTAC1215-SP machine designed exclusively for Copper conductive film coating on Ceramic chips, ceramic circuit board.

Please contact us for more specifications, Royal Technology is honored to provide you total coating solutions.
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