Premium Soft 3.0W Thermal Conductivity Silicone Thermal Pad With Adhesive For Advanced Cooling Needs

Premium Soft 3.0W Thermal Conductivity Silicone Thermal Pad With Adhesive For Advanced Cooling Needs

Ziitek thermal conductive interface materials are widely recognized and trusted by users and can meet continuously developing economic and social needs.Ziitek provide thermal conductive gap fillers, low melting point thermal interface materials, thermal conductive insulators, thermally conductive tapes, electrically & thermally conductive Interface pads and thermal grease,Thermal Conductive plastic,Silicone Rubber,Silicone Foams,Phase Changing Materials products and so on, for various applications.

The TIF^®180-30-11E Series is a silicone based, thermally conductive gap pad. Its unreinforced construction allows additional compliancy. This product has low hardness is conformable and is electrically isolating. The low modulus characteristic of the product offers optimal thermal performance with the ease of handling.

Features

> Good thermal conductive: 3.0W/mK

> Naturally tacky needing no further adhesive coating
> Available in varies thickness
> Soft and compressible for low stress applications
> RoHS compliant
> UL recognized

Applications

> PCB/CPU/LED
> High speed mass storage drives
> Heat Sinking Housing at LED-lit BLU in LCD
> RDRAM memory modules
> Micro heat pipe thermal solutions
> Automotive engine control units
> Telecommunication hardware
> Handheld portable electronics
> Routers

Dongguan Ziitek Electronical Material and Technology Ltd. provides product solutions to equipment product which generates too much heat affecting its high performance when using. Plus thermal products can control and manage heat to keep it cool to some extent.  

Ziitek D-U-N-S® Number: 656191068