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| Categories | Thermal Conductive Pad |
|---|---|
| Brand Name: | ZIITEK |
| Model Number: | TIF100-30-11U |
| Certification: | UL and RoHs |
| Place of Origin: | China |
| MOQ: | 1000pcs |
| Price: | Negotiation |
| Supply Ability: | 10000pcs/day |
| Delivery Time: | 3-5 days |
| Packaging Details: | 1000pcs/bag |
| Payment Terms: | T/T |
| Products name: | Super Quality Self-Adhesive Surface 3.0W Dark Gray Silicone Thermal Conductive Pad For Motherboard Chip |
| Color: | Dark Gray |
| Thermal conductivity: | 3.0W/m-K |
| Hardness: | 27/65 Shore 00 |
| Density: | 3.0 g/cm³ |
| Breakdown Voltage(V/mm)): | ≥5500 |
| Flame rating: | 94-V0 |
| Keywords: | Silicone Thermal Conductive Pad |
| Application: | Motherboard Chip |
| Company Info. |
| Dongguan Ziitek Electronic Materials & Technology Ltd. |
| Verified Supplier |
| View Contact Details |
| Product List |
Super Quality Self-Adhesive Surface 3.0W Dark Gray Silicone Thermal Conductive Pad For Motherboard Chip
Ziitek company is a high-tech enterprise which dedicated to the
R&D, manufacture and sales of the thermal interface materials
(TIMs). We have rich experiences in this field which can support
you the latest, most effective and one -step thermal management
solutions. We have many advanced production equipments,full test
equipments and fully automatic coating production lines which can
support the production for high performance thermal silicone pad,
thermal graphite sheet/ film, thermal double-sided tape, thermal
insulation pad, thermal ceramic pad, phase change material, thermal
grease etc. UL94 V-0, SGS and ROHS are compliant.
The TIF®100-30-11U Series thermal pad is a very cost-effective general economic thermal gap
filling gasket, soft with its own micro-stick, easy assembly. Under
low compressing force to show good thermal conductivity and
electrical insulation properties. Bedding on the gap between the
heat device and the heat sink or the machine shell to extrude air
to reach the full contact forming a continuous thermal conduction.
Using heat sink or machine shell as a cooling device can
effectively increase the cooling area to achieve a good cooling
purposes.
Features
> Good thermal conductive
> Broad range of hardnesses available
> Moldability for complex parts
> Outstanding thermal performance
> High tack surface reduces contact resistance
Applications
> Computer / communication equipment.
> Laptop / tablet / PC server.
> New energy power battery / vehicle equipment.
> Switching power supply / UPS.
> Video / security equipment.
> Any heating element and radiator.
| Typical Properties of TIF®100-30-11U Series | |||
| Property | Value | Test method | |
| Color | Dark Gray | Visual | |
| Construction & Compostion | Ceramic filled silicone elastomer | ****** | |
| Density(g/cm³) | 3.0 | ASTM D792 | |
| Thickness Range(inch/mm) | 0.010~0.020 | 0.030~0.200 | ASTM D374 |
| (0.25~0.50) | (0.75~5.00) | ||
| Hardness | 65 Shore 00 | 27 Shore 00 | ASTM 2240 |
| Continuos Use Temp | -40 to 200℃ | *** | |
| Breakdown Voltage(V/mm) | ≥ 5500 | ASTM D149 | |
| Dielectric Constant | 7.0 MHz | ASTM D150 | |
| Volume Resistivity | >1.0X1012 Ohm-meter | ASTM D257 | |
| Thermal Conductivity (W/m-K) | 3.0 | ASTM D5470 | |
| 3.0 | ISO22007 | ||
| Fire rating | V-0 | UL 94 (E331100) | |

Q: What thermal conductivity test method was used to achieve the values given on the data sheets?
A: A test fixture is utilized that meets the specifications outlined in ASTM D5470.
Q: Is GAP PAD offered with an adhesive?
A: Currently, Most of thermal gap pad surface has double side natural inherent tack,Non-stick surface can also be treated according to customer's requirements.
Q: Are you trading company or manufacturer ?
A: We are manufacturer in China.
Q: How long is your delivery time?
A: Generally it is 3-7 work days if the goods are in stock. or it is 7-10 work days if the goods are not in stock, it is according to quantity.
Q: Do you provide samples ? is it free or extra cost?
A: Yes, we could offer samples free of charge.
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