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99.9% Purity Red Rolled Electrodeposited Copper Foil

Categories Electrolytic Copper Foil
Brand Name: OEM
Place of Origin: China
Certification: ISO / SGS / RoHS
Supply Ability: 550T Per Month
Packaging Details: Exporting Wooden Case
MOQ: 50kg
Price: Negotiable
Delivery Time: 10 - 15 Days
Payment Terms: L/C, T/T
Application: terminals
Width: 7--610mm
Material: Red Copper
Grade: Pure Copper
Cu (Min): 99.90%
Alloy Or Not: Non-alloy
Processing Service: Bending, Welding, Decoiling, Cutting, Punching, Coating
Name: High purity 99.9% electrolytic copper foil
Shape: customised
Color: Red
Type: Flat
Length: Customer's Demands
Electric 20 CConductivity: C1100 >97%
State: custom
Package: Fumigation Wooden Package
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99.9% Purity Red Rolled Electrodeposited Copper Foil

99.9% Purity Red Rolled Electrodeposited Copper Foil


Description:


Electrolytic copper foil is a foil-based form of copper with a thickness generally less than 80micron. A rolled foil is made by annealing and rolling the electrolytic copper uninterruptedly.The production process involves electrodepositing copper to a rolling drum and then again rolling it up. For the process of electrodeposition, high-grade copper is dissolved in acid to form a copper electrolyte. This copper electrolyte solution is then pumped into electrically charged rotating drums. On drums, a thin film of copper is then electrodeposited. This process is also called as electrolytic plating. Electrolytic copper foils provide exceptional tensile strength as well as increased elongation characteristics. These foils are most commonly used as a superconductor in printed circuit boards as well as flexible connectors. Since, copper possesses high electrical conductivity, and is extraordinarily ductile and malleable,makes it one of the most extensively used metals in the everemerging electrical and electronics industry.


Feature:


1, symmetrical structure of both sides,99.9% copper density,very low profile.
2, high elongation and tensile strength
3, very environmental,can be recycled


Technical Data:


ClassificationUnit9μm12μm18μm35μm
Cu Content%≥99.8
Area Weigthg/m280±3107±3153±5283±7
Tensile StrengthR.T.(23℃)Kg/mm2≥28
H.T.(180℃)≥15≥15≥15≥18
ElongationR.T.(23℃)%≥5.0≥5.0≥6.0≥10
H.T.(180℃)≥6.0≥6.0≥8.0≥8.0
RoughnessShiny(Ra)μm≤0.43
Matte(Rz)≤2.5
Peel StrengthR.T.(23℃)Kg/cm≥0.77≥0.8≥0.8≥0.8
Degraded rate of HCΦ(18%-1hr/25℃)%≤7.0
Change of color(E-1.0hr/200℃)%Good
Solder Floating 290℃Sec.≥20
Appearance(Spot and copper powder)----None
PinholeEAZero
Size ToleranceWidthmm0~2mm
Lengthmm----
CoreMm/inch

Inside Diameter 79mm/3 inch


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