| Sign In | Join Free | My benadorassociates.com |
|
| Categories | Hermetic Optical Fiber Communication Package |
|---|---|
| Brand Name: | JOPTEC |
| Place of Origin: | HEFEI, CHINA |
| MOQ: | 50 PCS |
| Payment Terms: | T/T |
| Supply Ability: | 5000000 PCS/Month |
| Delivery Time: | 30 Days |
| Packaging Details: | Boxes |
| Material: | Housing kovar ring; kovar lead; base Wcu ; ceramic insulator. |
| Finish: | Fully plating Au.(Finish could adopt fully plating or selective plating.) |
| Cover plate: | 4J42(42alloy) |
| Glass insulators: | BH-A/K |
| Lead: | 4J29(Kovar) |
| Welding ring: | HLAgCu28 |
| Tube: | 4J29(Kovar) |
| Cavity: | 4J29(Kovar) |
| Insulation Resistance: | 100V DC resistance between single pin and package is ≥1*1010Ω |
| Company Info. |
| JOPTEC LASER CO., LTD |
| View Contact Details |
| Product List |
| Product name: | Fiber optic electronic component housing | |
| Material: | Housing kovar ring; kovar lead; base Wcu ; ceramic insulator. | |
| Finish: | Fully plating Au.(Finish could adopt fully plating or selective plating.) | |
| Plating: | The cavity, the lead and the cover plate are plated Ni8-12um, the cavity, the lead and the cover plate are plated with Au0.04-0.1um. | |
| product information: | Material | Quantity |
| 1. Cover plate | 4J42(42alloy) | 1 |
| 2. Glass insulators | BH-A/K | 2 |
| 3. Lead1 | 4J29(Kovar) | 2 |
| 4. Welding ring1 | HLAgCu28 | 1 |
| 5. Lead2 | 4J29(Kovar) | 1 |
| 6. Welding ring2 | HLAgCu28 | 1 |
| 7. Tube | 4J29(Kovar) | 1 |
| 8. Cavity | 4J29(Kovar) | 1 |
| Insulation Resistance | 100V DC resistance between single pin and package is ≥1*1010Ω | |
| Hermeticity | Leak rate is ≤1*10-3Pa.cm3/s | |
| Product features: | 1.Fiber optic packages have different structures include optical port ; | |
2.The material of housing are different and are adopted by different features of packages. | ||
| 3.The sections of pin are rectangular or cyclinder. | ||
| 4.The pin cross bottom or sidewall whose rank accord to customers' needs | ||
5.The sealing cap or lid method adopts proper technique according to structure of packages. | ||
| 6.Finish could adopt fully plating or lead selective plating. | ||
|