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Hardness 12.9Gpa 96% HAP Alumina Ceramic Parts For Charging Relay

Categories Metallized Ceramic
Brand Name: CMC
Model Number: TCKT120
Certification: IATF16949, ISO9001, ISO14001
Place of Origin: China
MOQ: 2000 pieces
Price: USD 1.25~2.35/piece
Payment Terms: T/T, Western Union, L/C
Supply Ability: 60,000 pieces per month
Delivery Time: 20 days
Packaging Details: Package is Plastic film, foam plate, paper plate,carton
Material: 95% Alumina
Color: White
Application: Relay
Density: 3.7g/cm3
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Hardness 12.9Gpa 96% HAP Alumina Ceramic Parts For Charging Relay

TCKT120 96% HAP alumina ceramic parts for charging relay


1. Description:


TCKT120 96% HAP alumina ceramic parts for charging relay is made of alumina materials, and it is thick-film nickel plating on surface connection header.It is suitable for brazing different materials such as copper and alloys. It can meet the requirements of at the same time, and it can . Reaching the , it is currently an excellent technical solution in the field of


2. Key Words:


Seismic and tensile,withstand high current and arc shock,reliable sealing and insulation standards of DC high-voltage relays,new energy vehicles and DC high-voltage electronic control,manufacture samples , open mould ,aluminum oxide,thick-film nickel plating technology,copper and alloys,great limberness,Good corrosion resistance,High intensity,Good high-temperature resistance performance,High purity.


3. Technical Parameters table:


Product Parameters
Physical PropertyMaterial95% Alumina
Production ProcessDry Pressing
Product DimensionPer customers' drawing
Density (g/cm3)3.70-3.75g/cm3
Water Absorption0%
Mechanical PerformanceFlexural Strength (Mpa)310Mpa
Modulus of Elasticity (Gpa)310Gpa
Hardness (Gpa)12.9Gpa
Poisson Ratio0.23
Thermal CharacterLinear Thermal Expansion Coefficient7.2
Heat Conductivity (W/mk)23
Electrical PropertyDielectric Constant9.2
Dielectric Loss Tangent (x10-4)8
Insulation Strength (x106V/M)15
Metalized Ceramic PerformanceAir Tightness (Pa·m3/s)≤10-8
Bulk Resistivity (Ω·cm)≥1010 (20°C), ≥106 (300°C)
Bonding Strength (Mpa)≥120Mpa
Metallization Thickness (μm)≥20μm


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