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15mil TMM10 Rogers PCB Board With Green Solder Mask For Chip Testers

Categories Rogers PCB Board
Brand Name: Bicheng
Model Number: BIC-148.V1.0
Certification: UL, ISO9001, IATF16949
Place of Origin: CHINA
MOQ: 1PCS
Price: USD9.99-99.99
Payment Terms: T/T
Supply Ability: 5000PCS per month
Delivery Time: 8-9 working days
Packaging Details: Vacuum bags+Cartons
Base material: Ceramic, Hydrocarbon, Thermoset Polymer Composites
Layer count: Double Layer, Multilayer, Hybrid PCB
PCB size: ≤400mm X 500mm
PCB thickness: 15mil (0.381mm), 20mil (0.508mm), 25mil (0.635mm), 30mil(0.762mm), 50mil (1.27mm), 60mil (1.524mm), 75mil(1.905mm), 100mil (2.54mm), 125mil (3.175mm), 150mil (3.81mm), 200mil (5.08mm), 250mil (6.35mm), 275mil (6.985mm), 300mil (7.62mm), 500m
Solder mask: Green, Black, Blue, Yellow, Red etc.
Copper weight: 0.5oz (17 µm), 1oz (35µm), 2oz (70µm)
Surface finish: Bare copper, HASL, ENIG, OSP etc..
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15mil TMM10 Rogers PCB Board With Green Solder Mask For Chip Testers


Rogers 15mil TMM10 High Frequency PCB With Immersion Gold and Green Solder Mask for Chip Testers

(Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)


Rogers’ TMM10 thermoset microwave materials are ceramic, hydrocarbon, thermoset polymer composites designed for high plated-thru-hole reliability stripline and microstrip applications.


TMM10 laminates' electrical and mechanical characteristics combine many of the advantages of ceramic and conventional PTFE microwave circuit laminates without the need for the specific manufacturing processes typical of these materials.


The thermal coefficient of dielectric constant of TMM10 laminates is typically less than 30 ppm/°C, which is extremely low. The material can produce high reliability plated through holes with minimal etch shrinkage values thanks to its isotropic coefficients of thermal expansion, which are extremely closely matched to those of copper. Additionally, TMM10 laminates' thermal conductivity is about twice as high as that of conventional PTFE/ceramic laminates, making it easier to remove heat from the system.


The thermoset resins used in TMM10 laminates prevent them from softening when heated. As a result, there is no need to worry about pad lifting or other issues while wire bonding component leads to circuit traces.


Some Typical Applications:

1. Filters and coupler

2. Power amplifiers and combiners

3. RF and microwave circuitry


Our Capabilities (TMM10)

PCB Material:Ceramic, Hydrocarbon, Thermoset Polymer Composites
Designation:TMM10
Dielectric constant:9.20 ±0.23
Layer count:Double Layer, Multilayer, Hybrid PCB
Copper weight:0.5oz (17 µm), 1oz (35µm), 2oz (70µm)
PCB thickness:15mil (0.381mm), 20mil (0.508mm), 25mil (0.635mm), 30mil(0.762mm), 50mil (1.27mm), 60mil (1.524mm), 75mil(1.905mm), 100mil (2.54mm), 125mil (3.175mm), 150mil (3.81mm), 200mil (5.08mm), 250mil (6.35mm), 275mil (6.985mm), 300mil (7.62mm), 500mil (12.70mm)
PCB size:≤400mm X 500mm
Solder mask:Green, Black, Blue, Yellow, Red etc.
Surface finish:Bare copper, HASL, ENIG, OSP etc..

Data Sheet of TMM10

TMM10 Typical Value
PropertyTMM10DirectionUnitsConditionTest Method
Dielectric Constant,εProcess9.20±0.23Z10 GHzIPC-TM-650 2.5.5.5
Dielectric Constant,εDesign9.8--8GHz to 40 GHzDifferential Phase Length Method
Dissipation Factor (process)0.0022Z-10 GHzIPC-TM-650 2.5.5.5
Thermal Coefficient of dielectric constant-38-ppm/°K-55-125IPC-TM-650 2.5.5.5
Insulation Resistance>2000-GohmC/96/60/95ASTM D257
Volume Resistivity2 x 108-Mohm.cm-ASTM D257
Surface Resistivity4 x 107-Mohm-ASTM D257
Electrical Strength(dielectric strength)285ZV/mil-IPC-TM-650 method 2.5.6.2
Thermal Properties
Decompositioin Temperature(Td)425425TGA-ASTM D3850
Coefficient of Thermal Expansion - x21Xppm/K0 to 140 ASTM E 831 IPC-TM-650, 2.4.41
Coefficient of Thermal Expansion - Y21Yppm/K0 to 140 ASTM E 831 IPC-TM-650, 2.4.41
Coefficient of Thermal Expansion - Z20Zppm/K0 to 140 ASTM E 831 IPC-TM-650, 2.4.41
Thermal Conductivity0.76ZW/m/K80 ASTM C518
Mechanical Properties
Copper Peel Strength after Thermal Stress5.0 (0.9)X,Ylb/inch (N/mm)after solder float 1 oz. EDCIPC-TM-650 Method 2.4.8
Flexural Strength (MD/CMD)13.62X,YkpsiAASTM D790
Flexural Modulus (MD/CMD)1.79X,YMpsiAASTM D790
Physical Properties
Moisture Absorption (2X2)1.27mm (0.050")0.09-%D/24/23ASTM D570
3.18mm (0.125")0.2
Specific Gravity2.77--AASTM D792
Specific Heat Capacity0.74-J/g/KACalculated
Lead-Free Process CompatibleYES----

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