Customized Multi Layer High Density HDI FR4 PCB with BGA / High TG

1. Product Descprition

2.HDI capablity and example

1) X+X process

( Layer Drawing) (Cross section)

2) 1-N-1 process

( Layer Drawing) (Cross section)

3)2-N-2 process-B

( Layer Drawing) (Cross section)

4)2-N-2 process-N(Advanced:6+N+6)

( Layer Drawing) (Cross section)

3. Application

1)Communication electronic equipment:Smartphone,Multifunctional Phone,visual telephone

2)Computer:Laptop, Super computer, Pad.

3) Consumer Electronics: Camera, Digital TV, Video

4) Car

5) Equipments

6) Space and aviation: satellite,guided missile

7) Medical Appliances

8) Industral Control

4.Package

Shenzhen Fanyi Technology Co.,Ltd established in 2013, based on Silicon Valley technology in the United States, dedicated to high cost-      effective PCB product production.Shenzhen Fanyi focus on R&D and production of high-end multi-layer printed circuit boards (2 - 60 layers) and HDI boards (1+H+1, 2+H+1, blind buried holes); our factory covers an area of 50,000 square meters and has a production capacity of 80,000 square meters PCB boards per month.

The factory has set up a team of Taiwanese executives and introduced professional imported equipment. We have strict QA system: carefully selected high-quality raw materials such as Shengyi(SYE)/kingBoard (KB) A-grade copper clad laminates and Taiyo solder mask inks. Our factory fully implements ISO9001:2015, ISO14001:2015, IATF16949:2016, UL, RoHS, REACH management system, strict implementation of IPCII standard, independent research and development of intelligent panel array system and real-time online tracking system for manufacture progress, all-round guarantee the "high quality, short delivery" service commitment.

Shenzhen Fanyi is the preferred supplier for communication equipment manufacturers, automobile manufacturers and medical enterprises, such as: HuaWei, ZTE, Datang Telecom, Xinwei Communication, Weichai, China South Locomotive, BYD, and Huada Gene. The products are widely applied by 20,0000+ worldwide enterprises on communications, medical, industrial control, security, automotive, electric power, aviation, military, computer peripherals and other fields.