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| Categories | Grinding Wheel For Semiconductor And Photoelectricity |
|---|---|
| MOQ: | 1PC |
| Price: | Negotiable |
| Payment Terms: | T/T |
| Supply Ability: | 20000 pcs per month capacity |
| Delivery Time: | 15-20 days delivery time |
| Packaging Details: | Box |
| Place of Origin: | China |
| Certification: | High QC standard, 100% inspection |
| Common Shape: | 3A1, 3A1R |
| Wheel Size: | OD:10-200 T:0.07-2.0 H:6, 8, 12.7, 31.75,50.8" |
| Advantage:: | high precision |
| Application: | Semiconductor & Photoelectricity |
| Bond: | Resin Metal |
| Grit size: | 3um-70um |
| Company Info. |
| Xinzheng Dia Abrasives Co.,Ltd |
| View Contact Details |
| Product List |
Ultra thin dicing blades are widely used in semiconducto industry
Features:
Specification:
| Specifications: | Application | |||||||
| Common Shape | Wheel Size | Grit Size | Classic Specification | Industry | Workpiece&Material | Machine | Bond | Working Data |
| 1A8, 1A1R | OD:10-200 T:0.07-2.0 H:6, 8, 12.7, 31.75,50.8 | 3um-70um | semiconductor industry optical glass industry optical communication | BGA, LGA, LED Blue glass, crystal, gem, filter quartz | Resin Metal | |||
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