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U77-A1114-100T SFP Cage Connector 1X1 PRESS FIT EMI Shielded

Categories SFP Cage Connector
Brand Name: LINK-PP
Model Number: U77-A1114-100T
Certification: ISO 9001, ISO 14001, UL, SGS, REACH168
Place of Origin: Guangdong,China
MOQ: 20/100/2kpcs
Price: $0.11-$35
Payment Terms: TT,NET30/60/90 Days
Supply Ability: 350K/Month
Delivery Time: Stock
Packaging Details: Tape and Reel, 20/Tray
Specifications: U77-A1114-100T
Connector Type: SFP
Mounting Type: Through Hole
Contact Plating: Tin
Termination Style: Solder Tail
Light Pipe: Without
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U77-A1114-100T SFP Cage Connector 1X1 PRESS FIT EMI Shielded

The U77-A1114-100T SFP Cage Connector is designed for high-speed data transmission applications, supporting up to 6Gb/s per channel. This versatile cage is compatible with multiple transceivers, offering a compact and cost-effective solution. It is designed to maximize PCB space utilization and is available in Press-Fit and solder-tail versions.


Electrical Performance

Operating Voltage

30 VDC per contact

Operating Current

0.5 A per contact

Differential Impedance

100Ω ± 10Ω

Mechanical Performance

Durability

250 mating cycles

Mating Force

Maximum of 50 N

Contact Normal Force

100 grams

PCB Thickness Solder-Post and Press-Fit (Cage)

1.45 mm (0.057 inches)

PCB Thickness Belly to Belly (Cage)

3.00 mm (0.118 inches)

Unmating Force (Cage)Maximum of 11.50 N
Insertion Force to PCB (Cage)1x1 port cage 500 N
Environmental Performance
Operating Temperature Range-40°C to +85°C
Storage Temperature Range-55°C to +85°C
RoHS & Halogen-FreeCompliant
Packagingtape and reel

U77-A1114-100T Dimension:


Target Markets of 1X1 SFP Cage Connector

  1. Cellular Infrastructure
  2. Network Interfaces
  3. Hubs
  4. Servers
  5. Storage Solutions
  6. Test and Measurement Equipment

U77-A1114-100T Materials (RoHS Compliant)

  • Cage: Made from copper alloy
  • Plating Option 1: 2.54 μm minimum bright tin plating over 1.27 μm minimum nickel underplating (with a solder temperature of up to 230°C)
  • Plating Option 2: 2.54 μm minimum matte tin plating over 1.27 μm minimum nickel underplating (with a solder temperature of up to 245°C for 10 seconds peak time)
  • Dust Cover: Thermoplastic, black color
  • Housing Material: Copper
  • Contact Plating: Tin

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