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| Categories | High Frequency PCB | 
|---|---|
| Brand Name: | China chao sheng | 
| Model Number: | CSPCB1460 | 
| Certification: | ISO/UL/RoHS/TS | 
| Place of Origin: | Shenzhen, Guangdong, China | 
| MOQ: | 1PCS | 
| Price: | USD2.8/pcs | 
| Payment Terms: | T/T, Western Union | 
| Supply Ability: | 50-2000K/pcs per month | 
| Delivery Time: | 20-25 working days | 
| Packaging Details: | Anti-static bag + Anti-static bubble wrap + Good quality carton box | 
| Product Area: | Communication System Equipment | 
| Copper Thickness: | 1/1/0.5/0.5/0.5/0.5/0.5/0.5/1OZ | 
| Board Thickness: | 1.80mm | 
| Impedance Value: | ± 10% | 
| Material: | FR-4, TG170 Halogen-free | 
| Product Structure: | 10 Layers Level 2 HDI | 
| Minimum Hole: | 0.35mm | 
| Provide PCB Information: | Gberber, Production Requirements, MOQ Quantity | 
| Surface Treatment: | Immersion Gold, Electro-nickel Gold, Immersion Tin, OSP, Lead-free Spray Tin | 
| E-Test: | 100% Electrical Test Prior Shipment | 
10 layers Level 2 HDI Large Industrial communication PCB HDI FR-4, TG150 Halogen-free Thick copper + thick goldinner and outer copper ,HDI Printed Circuit Boards,prototype pcb fabrication
Product Description
Our Service
Quality Assurance:
Our Quality processes include:
1. IQC: Incoming Quality Control (Incoming Materials Inspection)
2. First Article Inspection for every process
3. IPQC: In Process Quality Control
4. QC: 100% Test & Inspection
5. QA: Quality Assurance based on QC inspection again
6. Workmanship: IPC-A-610, ESD
7. Quality Management based on CQC, ISO9001:2008, ISO 14001:2004
Certificates:
ISO9001-2008
ISO/TS16949
UL
IPC-A-600G and IPC-A-610E Class II compliance
Customer's requirements
Quick Detail:
1. PCB Assembly on SMT and DIP
2. PCB schematic drawing/ layout /producing
3. PCBA clone/change board
4. Components sourcing and purchasing for PCBA
5. Enclosure design and plastic injection molding
6. Full range of testing services. Including: AOI, Fuction Testing , In Circuit Testing, X-Ray For BGA Testing,
7. IC programming
PCB, FPC product application field
Various digital products, automotive new energy, automotive
products, military, aerospace, medical, wireless terminals, wired
terminals, communication equipment, communication stations,
finance, industrial industrial control, consumer electronics,
educational equipment, smart devices, smart products, security,
LED, computer, mobile phone and other electronic products
FAQ:
Q: What files do you use in PCB fabrication?
A: Gerber or Eagle, BOM listing, X, Y sitting report, PNP and
Components Position
Q: Is it possible you could offer sample?
A: Yes, we can custom you sample to test before mass production
Q: When will I get the quotation after sent Gerber, BOM and test
procedure?
A: Within 6-48hours for PCB quotation and around 24-48 hours for
PCBA quotation.
Q: According to the difficulty of high-layer boards, How can I know
the process of my PCB production?
A: 7-35days for PCB production and components purchasing, and
14-20days for PCB assembly and Testing
Q: How can I make sure the quality of my PCB?
A: We ensure that each piece of PCB, PCBA products work well before
shipping. We'll test all of them according to your test procedure.
PCB, FPC process production capability
| Technical ltem | MassProduct | Advanced Technology | |||||
| 2016 | 2017 | 2018 | |||||
| Max.Layer Count | 26L | 36L | 80L | ||||
| Through-hole plate | 2~45L | 2~60L | 2~80L | ||||
| Max.PCBSize(in) | 24*52" | 25*62" | 25*78.75" | ||||
| The layer number of FPC | 1~36L | 1~50L | 1~60L | ||||
| Max.PCBSize(in) | 9.8"*196" | 9.8"*196" | 10"*196"Reel to reel | ||||
| Layeredplatelayer | 2~12L | 2~18L | 2~26L | ||||
| Max.PCBSize(in) | 9"*48" | 9"*52" | 9"*62" | ||||
| Combination of hard and soft layers | 3~26L | 3~30L | 3~50L | ||||
| Interconnect HDI | 5+X+5Interconnect HDI | 7+X+7Interconnect HDI | 8+X+8,Interconnect HDI | ||||
| HDI PCB | 4~45L | 4~60L | 4~80L | ||||
| Interconnect HDI | 3+20+3 | 4+X+4Interconnect HDI | 4+X+4,Interconnect HDI | ||||
| Max.PCBSize(in) | 24"*43" | 24"*49" | 25"*52" | ||||
| Material | FR-4 Rogers | FR-4 Rogers | FR-4 Rogers | ||||
| Base material | Halogenfree,LowDK | Halogenfree,LowDK | Halogenfree,LowDK | ||||
| Build-up Material | FR-4 | FR-4 | FR-4 | ||||
| BOard,Thickness(mm) | Min.12L(mm) | 0.43 | 0.42~8.0mm | 0.38~10.0mm | |||
| Min.16L(mm) | 0.53 | 1.60~8.0mm | 0.45~10.0mm | ||||
| Min.18L(mm) | 0.63 | 2.0~8.0 | 0.51~10.0mm | ||||
| Min.52L(mm) | 0.8 | 2.50~8.0mm | 0.65~10.0mm | ||||
| MAX(mm) | 3.5 | 10.0mm | 10.0mm | ||||
| Min.CoreThickness um(mil) | 254"(10.0) | 254"(10.0) | 0.10~254(10.0mm) | ||||
| Min.Build up Dielectric | 38(1.5) | 32(1.3) | 25(1.0) | ||||
| BaseCopperWeight | Inner Layer | 4/1-8 OZ | 4/1-15 OZ | 4/1-0.30mm | |||
| Out Layer | 4/1-10 OZ | 4/1-15 OZ | 4/1-30 OZ | ||||
| Gold thick | 1~40u" | 1~60u" | 1~120u" | ||||
| Nithick | 76~127u" | 76~200u" | 1~250u" | ||||
| Min.HOle/Land um(mil) | 150/300(6/12) | 100/200(4/8) | 100/200(4/8) | ||||
| Min.Laser via/landum(mil) | 60/170(2.4/6.8) | 50/150(2/6) | 50/150(2/6) | ||||
| Min. IVH,Hole size/landum(mil) | 150/300(6/12) | 100/200(4/8) | 100/200(4/8) | ||||
| DieletricThickness | 38(1.5) | 32(1.3) | 32(1.3) | ||||
| 125(5) | 125(5) | 125(5) | |||||
| SKipvia | Yes | Yes | Yes | ||||
| viaoNhie(laserviaon BuriedPTH) | Yes | Yes | Yes | ||||
| Laser Hole Filling | Yes | Yes | Yes | ||||
| Technicalltem | Mass Product | Advanced Technolgy | |||||
| 2017year | 2018year | 2019year | |||||
| Drill hole depth ratio | ThroughHole | 2017year | .40:1 | .40:1 | |||
| Aspet Ratio | Micro Via | .35:1 | 1.2:1 | 1.2:1 | |||
| Copper Filling Dimple Size um(Mil) | 10(0.4) | 10(0.4) | 10(0.4) | ||||
| Min.LineWidth&space | lnner Layer um(mil) | 45/45(1.8/1.8) | 38/38(1.5/1.5) | 38/38(1.5/1.5) | |||
| Plated Layer um(mil) | 45/45(1.8/1.8) | 38/38(1.5/1.5) | 38/38(1.5/1.5) | ||||
| BGAPitch mm(Mil) | 0.3 | 0.3 | 0.3 | ||||
| Min.PTH Hole ring um(mil) | 75(3mil) | 62.5(2.5mil) | 62.5(2.5mil) | ||||
| Line Width Control | ∠2.5MIL | ±0.50 | ±0.50 | ±0.50 | |||
| 2.5Mil≤L/W∠4mil | ±0.50 | ±0.50 | ±0.50 | ||||
| ≦3mil | ±0.60 | ±0.60 | ±0.60 | ||||
| Laminated structure | Layer by layer | 3+N+3 | 4+N+4 | 5+N+5 | |||
| Sequential Build-up | 20L Any Layer | 36L Any Layer | 52L Any Layer | ||||
| Multi-layer overlay | N+N | N+N | N+N | ||||
| N+X+N | N+X+N | N+X+N | |||||
| sequential Lamination | 2+(N+X+N)+2 | 2+(N+X+N)+2 | 2+(N+X+N)+2 | ||||
| Soft and hard bonding | 2+(N+X+N)+2 | 2+(N+X+N)+2 | 2+(N+X+N)+2 | ||||
| PTH filling process | PTH resin plug hole + plating fill Electroplated hole/copper plug hole | PTH resin plug hole + plating fill Electroplated hole/copper plug hole | PTH resin plug hole + plating fill Electroplated hole/copper plug hole | ||||


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