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Rogers RO4535 High Frequency Printed Circuit Board RO4535 60mil 30mil 20mil Antenna PCB with Immersion Gold, Silver and

Categories Rogers PCB Board
Brand Name: Bicheng
Model Number: BIC-189.V1.0
Certification: UL, ISO9001, IATF16949
Place of Origin: CHINA
MOQ: 1PCS
Price: USD9.99-99.99
Payment Terms: T/T
Supply Ability: 5000PCS per month
Delivery Time: 8-9 working days
Packaging Details: Vacuum bags+Cartons
Base material: Ceramic-filled, Glass-reinforced Hydrocarbon
Layer count: Double Sided PCB, Multilayer PCB, Hybrid PCB
PCB thickness: 20mil (0.508mm), 30mil (0.762mm), 60mil (1.524mm )
PCB size: ≤400mm X 500mm
Solder mask: Green, Black, Blue, Yellow, Red etc.
Copper weight: 0.5oz (17 µm), 1oz (35µm), 2oz (70µm)
Surface finish: Bare copper, HASL, ENIG, Immersion silver, Immersion tin, OSP, Pure gold plated etc..
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Rogers RO4535 High Frequency Printed Circuit Board RO4535 60mil 30mil 20mil Antenna PCB with Immersion Gold, Silver and


Rogers RO4535 High Frequency Printed Circuit Board RO4535 60mil 30mil 20mil Antenna PCB with Immersion Gold, Silver and Tin

(Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)


General Description

RO4535 High Frequency Laminates, ceramic-filled, glass-reinforced hydrocarbon based material, are cost/performance materials from Rogers Corporation, specifically engineered and manufactured to meet the specific demands of the antenna markets. It has a dielectric constant of 3.44 and a loss tangent (Df) of 0.0037 measured at 10 GHz. These values allow antenna designers to realize substantial gain values while minimizing signal loss. Thus, it provides excellent passive intermodulation response required for mobile infrastructure microstrip antenna applications.


It is an affordable alternative to more conventional PTFE antenna technologies, thus allowing our designers to optimize the price and performance of the antennas. The resin systems of RO4535 dielectric materials are designed to provide the necessary properties for ideal antenna performance. The coefficients of thermal expansion (CTEs) in both the X and Y directions are similar to that of copper. The good CTE match reduces stresses in the printed circuit board antenna.


Features and Benefits

1. Low Loss 0.0037 , Low Dk 3.44, low PIM response: Wide range of application use

2. Thermoset resin system: Compatible with standard PCB fabrication

3. Excellent dimensional stability: Greater yield on larger panels sizes

4. Uniform mechanical properties: Maintains mechanical form during handling

5. High thermal conductivity: Improved power handling


Typical Applications:

1. Cellular infrastructure base station antennas

2. WiMAX antenna networks



Our PCB Capability (RO4535)

PCB Material:Ceramic-filled, Glass-reinforced Hydrocarbon
Designation:RO4535
Dielectric constant:3.44
Dissipation Factor0.0037 10GHz
Layer count:Double Sided PCB, Multilayer PCB, Hybrid PCB
Copper weight:0.5oz (17 µm), 1oz (35µm), 2oz (70µm)
PCB thickness:20mil (0.508mm), 30mil (0.762mm), 60mil (1.524mm )
PCB size:≤400mm X 500mm
Solder mask:Green, Black, Blue, Yellow, Red etc.
Surface finish:Bare copper, HASL, ENIG, Immersion silver, Immersion tin, OSP, Pure gold plated etc..

RO4535 Typical Values

PropertyRO4535DirectionUnitsConditionTest Method
Dielectric Constant, er Process3.44 ± 0.08Z-10 GHz/23 2.5 GHzIPC-TM-650,2.5.5.5
Dissipation Factor0.0032Z-2.5 GHz/23IPC-TM-650, 2.5.5.5
0.003710 GHz/23
PIM (Typical)-157-dBcReflected 43 dBm swept tonesSummitek 1900b PIM Analyzer
Dielectric Strength>500ZV/mil0.51 mmIPC-TM-650, 2.5.6.2
Dimensional Stability<0.5X,Ymm/m (mils/inch)after etchIPC-TM-650, 2.4.39A
Coefficient of Thermal Expansion16Xppm/-55 to 288IPC-TM-650, 2.4.41
17Y
50Z
Thermal Conductivity0.6-W/(m.K)80ASTM C518
Moisture Absorption0.09-%D48/50IPC-TM-650, 2.6.2.1 ASTM D570
Tg>280- TMAAIPC-TM-650, 2.4.24.3
Density1.9-gm/cm3-ASTM D792
Copper Peel Strength5.1 (0.9)-lbs/in (N/mm)1 oz. EDC post solder floatIPC-TM-650, 2.4.8
FlammabilityV-0---UL 94
Lead-Free Process CompatibleYes----


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