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Rogers RT/Duroid 6006 High Frequency PCB With Green Solder Mask

Categories Rogers PCB Board
Brand Name: Bicheng
Model Number: BIC-062.V1.0
Certification: UL, ISO9001, IATF16949
Place of Origin: CHINA
MOQ: 1PCS
Payment Terms: T/T
Supply Ability: 5000PCS per month
Delivery Time: 8-9 working days
Packaging Details: Vacuum bags+Cartons
Base material: Ceramic-PTFE composite
Layer count: 1 Layer, 2 Layer
PCB thickness: 10mil (0.254mm), 25mil (0.635mm), 50mil (1.27mm), 75mil (1.90mm)
PCB size: ≤400mm X 500mm
Solder mask: Green, Black, Blue, Yellow, Red etc.
Copper weight: 0.5oz (17 µm), 1oz (35µm), 2oz (70µm)
Surface finish: Bare copper, HASL, ENIG, Immersion tin, OSP.
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Rogers RT/Duroid 6006 High Frequency PCB With Green Solder Mask


Rogers RT/Duroid 6006 High Frequency PCB


Rogers RT/duroid 6006 microwave laminates are ceramic-PTFE composites which are designed for electronic and microwave circuit applications requiring a high dielectric constant. RT/duroid 6006 laminate is available with a dielectric constant value of 6.15.



RT/duroid 6006 microwave laminates feature ease of fabrication and stability in use. This property results in the possibility of mass production and reducing the cost of goods. It has tight dielectric constant and thickness control, low moisture absorption, and good thermal mechanical stability.




RT/Duroid 6006 printed circuit boards are widely used in aircraft collision avoidance systems, ground radar warning systems, patch antennas and satellite communications systems etc.


RT/duroid 6006 Typical Value
PropertyRT/duroid 6006DirectionUnitsConditionTest Method
Dielectric Constant,εProcess6.15±0.15Z10 GHz/23℃IPC-TM-650 2.5.5.5 Clamped stripline
Dielectric Constant,εDesign6.45Z8GHz to 40 GHzDifferential Phase Length Method
Dissipation Factor,tanδ0.0027Z10 GHz/AIPC-TM-650 2.5.5.5
Thermal Coefficient of ε-410Zppm/℃-50℃-170℃IPC-TM-650 2.5.5.5
Volume Resistivity7 x 107Mohm.cmAIPC 2.5.17.1
Surface Resistivity2 x 107MohmAIPC 2.5.17.1
Tensile PropertiesASTM D638 (0.1/min. strain rate)
Young's Modulus627(91) 517(75)X YMPa(kpsi)A
Ultimate Stress20(2.8) 17(2.5)X YMPa(kpsi)A
Ultimate Strain12 to 13 4 to 6X Y%A
Compressive PropertiesASTM D695 (0.05/min. strain rate)
Young's Modulus1069 (115)ZMPa(kpsi)A
Ultimate Stress54(7.9)ZMPa(kpsi)A
Ultimate Strain33Z%
Flexural Modulus2634 (382) 1951 (283)XMPa(kpsi)AASTM D790
Ultimate Stress38 (5.5)X YMPa(kpsi)A
Deformation under load0.33 2.1Z Z%24hr/50℃/7MPa 24hr/150℃/7MPaASTM D261
Moisture Absorption0.05%D48/50℃ 0.050"(1.27mm) thickIPC-TM-650 2.6.2.1
Thermal Conductivity0.49W/m/k80℃ASTM C518
Coefficient of Thermal Expansion47
34
117
X
Y
Z
ppm/℃23℃/50% RHIPC-TM-650 2.4.41
Td500℃ TGAASTM D3850
Density2.7g/cm3ASTM D792
Specific Heat0.97(0.231)j/g/k
(BTU/ib/OF)
Calculated
Copper Peel14.3 (2.5)pli (N/mm)after solder floatIPC-TM-650 2.4.8
FlammabilityV-0UL 94
Lead-free Process CompatibleYes


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