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| Categories | Thermal Conductive Pad |
|---|---|
| Brand Name: | AOK |
| Model Number: | TP |
| Certification: | RoHS, Reach, UL |
| Place of Origin: | China |
| MOQ: | 1000pcs |
| Payment Terms: | T/T |
| Delivery Time: | 13-15working days |
| Packaging Details: | 400mmx200mm |
| Product name: | Low Thermal Resistance Thermal Conductive Silicone Pad For CPU With Die-Cuting |
| Composition: | Silicone |
| Elongation %: | 52 |
| Thickness: | 0.5~12.0(mm) |
| Thermal conductivity(W/m.K): | 1.2 |
| Hardness: | 20±5 (Shore OO) |
| Attribute | Value | Test Method |
|---|---|---|
| Composition | Ceramic Filler + Silicone | - |
| Color | Pink | Visual |
| Thickness (mm) | 0.5~12.0 | ASTM d374 |
| Density (g/cc) | 2.3 | ASTM D792 |
| Hardness (Shore OO) | 20±5 | ASTM D2240 |
| Tensile Strength(kn/m) | 0.4 | ASTM D624 |
| Elongation % | 52 | ASTM D412 |
| Usage Temperature(℃) | -40~150 | - |
| Electrical | ||
| Breakdown Voltage(kv/mm) | ≥6.5 | ASTM D149 |
| Dielectric Constant(@1mhz) | 5.3 | ASTM D150 |
| Volume Resistivity(Ω.cm) | 1.0*1012 | ASTM D257 |
| Flammability | V-0 | UL94 |
| Thermal | ||
| Thermal conductivity(W/m.K) | 1.2±0.1 | ASTM D5470 |
Product feature:
Typical applications:
Purchase information:
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