Aluminum BT Rogers Rigid Flex SMT PCB Assembly IATF TS16949 ISO13485

Categories	SMT PCB Assembly
Brand Name:	IBE
Model Number:	FG-02
Certification:	IATF/TS16949,ISO13485,ISO 9001,ISO14001,UL,ROHS
Place of Origin:	CHINA,VIETNAM,USA
MOQ:	NO MOQ
Payment Terms:	L/C, T/T
Delivery Time:	15 WORKING DAYS
Packaging Details:	BAG
Price:	Negotiable
Colour:	White
Name:	PCB assembly
Surface Technical:	Immersion Silver
Layer count:	6
Material:	Aluminum
Max panel size:	800mm*508mm

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Company Info.

IBE ELectronics Co.,LTD

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Company Profile

Aluminum BT Rogers Rigid Flex SMT PCB Assembly IATF TS16949 ISO13485

IATF/TS16949,ISO13485 Certified SMT PCB Assembly

Production capability

IBE Group invested in modernized equipment,such as automatic multi-layered PCB production equipment,high speed chip mounters and

online SPI machines.Our PCB production capacity is up to 180,000 square meters a month.We have 14 SMT lines,20 DIP lines,9 Assembly lines,12 testing lines.

IBE can mount chip components including 0201 and 01005 as well as QFP,BGA and fine pitch parts down to 0.3mm precision.

We can do many kinds of test,like X-Ray,Rohs,temperature test,Push and Pull test.

Our Advantages

1, PCB Making (Rigid, Flexible,Rigid-Flexible,Aluminium, High TG,Ceramic), Component Sourcing, SMT&DIP, Free Program & Test, OEM/ODM Serivce

2, Factory Area:60000㎡ Shenzhen factory; two other factories in US and Vietnam

3, Certifcation:ATF 16949,ISO 13485,ISO 14001,ISO9001,UL(E326838),Disney FAMA, CE,FCC,ROHS,

4, Quality Control:IPC-1-610E Standard,E-test,X-ray,AOI Test,IQC,QC,QA,100% Functional Test

1	Material	PR4,Halogen free, High TG,CEM3,PTFE,Aluminum BT,Rogers
2	Board Thickness	Mass Production:0.3-3.5mm Samples:0.21-6.0mm
3	Surface Finish	HASL,OSP,Immersion Silver/Gold/SN,Flash Gold, Gold Finger,Hard Gold Plating
4	PCB Panel Size	Max Mass Productoin: 610x460mm Sample:762x508mm
5	Layer	Mass production:2-58 Layers, Samples:1-64 Layers
6	Min. Drill Hole Size	Laser Drill 0.1mm,Machine Drill 0.2mm
7	PCBA QC	X-ray,AOI Test,Functional Test
8	Speciality	Automotive,Medical/Gaming/Smart Device,Computer,LED/Lighting,etc
9	Sanforized	Buried via, Blind via, Mixed Pressure,Embedded Resistance,Embedded Capacitance, Local Mixed Pressure, Local High Density, Back Drill, Impedance Control

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Aluminum BT Rogers Rigid Flex SMT PCB Assembly IATF TS16949 ISO13485

Aluminum BT Rogers Rigid Flex SMT PCB Assembly IATF TS16949 ISO13485

Aluminum BT Rogers Rigid Flex SMT PCB Assembly IATF TS16949 ISO13485

Aluminum BT Rogers SMT PCB Assembly

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Aluminum BT Rogers Rigid Flex SMT PCB Assembly IATF TS16949 ISO13485