Halogen Free Fr4 Pcb Assembly Printed Circuit Services TS16949

Categories	EMS PCB Assembly
Brand Name:	IBE
Model Number:	FG-02
Certification:	IATF
Place of Origin:	CHINA,VIETNAM,USA
MOQ:	NO MOQ
Price:	Negotiable
Payment Terms:	L/C, T/T
Delivery Time:	15 WORKING DAYS
Packaging Details:	BAG
Colour:	Black
Name:	PCB assembly
Layer:	6
Material:	Halogen free
Max panel size:	830mm*608mm
Surface:	ENIG

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Company Info.

IBE ELectronics Co.,LTD

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Company Profile

Halogen Free Fr4 Pcb Assembly Printed Circuit Services TS16949

Shenzhen,China EMS PCB Assembly Service

Production capability:

To shorten the clients' product cycle time to market,IBE Group invested in modernized equipment,such as automatic multi-layered PCB production equipment,high speed chip mounters and

online SPI machines.

Our PCB production capacity is up to 180,000 square meters a month.

We have 14 SMT lines,20 DIP lines,9 Assembly lines,12 testing lines.

IBE can mount chip components including 0201 and 01005 as well as QFP,BGA and fine pitch parts down to 0.3mm precision.

We can do many kinds of test,like X-Ray,Rohs,temperature test,Push and Pull test.

IBE sticks to the rigorous quality management,procedure control and sets up 100% complete AOI inspection.

We also provide technical support for our customer on analysis of design for manufacturability,product fault judgment,PCB layout components selection and component replacement evaluation,etc.

IBE has own R&D center with 30 engineers,they are experienced in software programming,circuit design and mechanical structure design.

1	Material	PR4,Halogen free, High TG,CEM3,PTFE,Aluminum BT,Rogers
2	Board Thickness	Mass Production:0.3-3.5mm Samples:0.21-6.0mm
3	Surface Finish	HASL,OSP,Immersion Silver/Gold/SN,Flash Gold, Gold Finger,Hard Gold Plating
4	PCB Panel Size	Max Mass Productoin: 610x460mm Sample:762x508mm
5	Layer	Mass production:2-58 Layers, Samples:1-64 Layers
6	Min. Drill Hole Size	Laser Drill 0.1mm,Machine Drill 0.2mm
7	PCBA QC	X-ray,AOI Test,Functional Test
8	Speciality	Automotive,Medical/Gaming/Smart Device,Computer,LED/Lighting,etc
9	Sanforized	Buried via, Blind via, Mixed Pressure,Embedded Resistance,Embedded Capacitance, Local Mixed Pressure, Local High Density, Back Drill, Impedance Control

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Halogen Free Fr4 Pcb Assembly Printed Circuit Services TS16949

Halogen Free Fr4 Pcb Assembly Printed Circuit Services TS16949

Halogen Free Fr4 Pcb Assembly Printed Circuit Services TS16949

Fr4 Pcb Assembly Printed Circuit Services

Halogen Free Fr4 Pcb Assembly

Halogen Free Printed Circuit Services TS16949

Halogen Free Fr4 Pcb Assembly Printed Circuit Services TS16949