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| Categories | Turnkey PCB Assembly |
|---|---|
| Place of Origin: | China |
| MOQ: | Negotiable |
| Price: | Negotiable |
| Payment Terms: | T/T |
| Supply Ability: | 100000pc/Month |
| Delivery Time: | 4 Weeks |
| Packaging Details: | PCB + Box |
| Brand Name: | CUSTOM MADE |
| Certification: | ISO/UL |
| Keyword: | Turnkey PCB Assembly |
| Applications: | Automotive Electronics, Communications, Battery Pack, PCBA Circuit Board |
| Copper Thickness: | 0.3-12 oz |
| Materials: | High-Tg FR4, RCC, FR4, M4, M6 |
| Service: | One-stop turnkey PCB assembly |
| Surface Finished: | Immersion Gold+OSP, HASL |
| PCB boards: | Rigid-Flex Board, Metal Substrate Boards |
| Number of layers: | 2-64 layers |
| Payment Method: | T/T |
| Whether to Support customization: | Support |
| Logistics: | Accept customer specified logistics |
| Company Info. |
| TONGZHAN INDUSTRIAL LIMITED |
| View Contact Details |
| Product List |
Turnkey PCB Assembly 2 - 68 Layers Electronical Products TU862 Peelable
Turnkey PCB Assembly Description:
1. Quick-turn and flexible delivery
2. Support a wide range of PCBs: high-layer, multi-layer,
rigid-flex, high frequency, high speed, etc.
3. Professional supplier positioning.
4. Seamless link from prototype to mass production.
5. Whole-flow quality assurance, IPC, Special industry inspection
standard.
Turnkey PCB Assembly Parameters:
Item | Technical Parameter |
Layer | 2-64 |
Thickness | 0.3-6.5mm |
Copper Thickness | 0.3-12 oz |
Min Mechanical Hole | 0.1mm |
Min Laser Hole | 0.075mm |
HDI | 1+n+1,2+n+2,3+n+3 |
Max Aspect Ratio | 20:01 |
Max Board Size | 650mm*1130mm |
Min Width/Space | 2.4/2.4mil |
Min Outline Tolerance | ±0.1mm |
Impedance Tolerance | ±5% |
Min PP Thickness | 0.06mm |
Bow &Twist | ≤0.5% |
Materials | FR4, High-Tg FR4, Rogers, Nelco, RCC, PTFE, M4, M6, TU862, TU872 |
Surface Finished | HASL, HASL Pb Free Immersion Gold/Tin/Silver Osp, Immersion Gold+OSP |
Special Capability | Gold Finger Plating, Peelable, Carbon ink |
Turnkey PCB Assembly Introduction:
1. Provide the required electrical characteristics, characteristic
impedance, and electromagnetic compatibility characteristics for
the circuit in high-speed or high-frequency circuits.
2. The printed board with passive components embedded inside
provides certain electrical functions, simplifies the electronic
installation procedure, and improves the reliability of the
product.
3. In large-scale and ultra-large-scale electronic packaging
components, an effective chip carrier is provided for the
miniaturized chip packaging of electronic components.
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