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RO4835 Rogers RF PCB Board 30mil ED Copper Multilayer

Categories RF PCB Board
Brand Name: Bicheng
Model Number: BIC-199.V1.0
Certification: UL, ISO9001, IATF16949
Place of Origin: CHINA
MOQ: 1PCS
Price: USD9.99-99.99
Payment Terms: T/T
Supply Ability: 5000PCS per month
Delivery Time: 8-9 working days
Packaging Details: Vacuum bags+Cartons
Base material: Hydrocarbon Ceramic Laminates
Layer count: Double Sided PCB, Multilayer PCB, Hybrid PCB
PCB thickness: 4mil (0.102mm), 10.7mil (0.272mm), 20.7mil (0.526mm), 30.7mil (0.780mm), 60.7mil (1.542mm)
PCB size: ≤400mm X 500mm
Solder mask: Green, Black, Blue, Yellow, etc.
Copper weight: 0.5oz (17 µm), 1oz (35µm), 2oz (70µm)
Surface finish: Bare copper, HASL, ENIG, Immersion silver, Immersion tin, OSP, Pure gold plated etc..
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RO4835 Rogers RF PCB Board 30mil ED Copper Multilayer


Rogers RO4835 High Frequency PCB 10mil 20mil 30mil ED Copper 10.7mil 20.7mil 30.7mil LoPro Copper

(Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)


General Description

Rogers RO4835 substrates are hydrocarbon ceramic laminates, a type of antioxidative high frequency materials for applications demanding greater stability at elevated temperatures. It is significantly more resistant to oxidation than other hydrocarbon based materials. RO4835 laminates are designed to offer superior high frequency performance and low cost circuit fabrication. Moreover, RO4835 material provides nearly identical electrical and mechanical properties to RO4350B laminates, which customers have used successfully for many years.


Oxidation affects all thermoset laminate materials over time and temperature. In the long term, oxidation can lead to small increases in dielectric constant and dissipation factor of the circuit substrate.


PropertyRO4835DirectionUnitsConditionTest Method
Dielectric Constant,εProcess3.48±0.05Z-10 GHz/23IPC-TM-650 2.5.5.5 Clamped Stripline
Dielectric Constant,εDesign3.66Z-8 to 40 GHzDifferential Phase Length Method
Dissipation Factortan,δ0.0037Z-10 GHz/23IPC-TM-650 2.5.5.5
Thermal Coefficient of ε+50Zppm/-100to 150IPC-TM-650 2.5.5.5
Volume Resistivity5 x 108MΩ.cmCOND AIPC-TM-650 2.5.17.1
Surface Resistivity7 x108COND AIPC-TM-650 2.5.17.1
Electrical Strength30.2(755)ZKv/mm(v/mil)IPC-TM-650 2.5.6.2
Tensile Modulus7780(1128)YMPa(ksi)RTASTM D 638
Tensile Strength136(19.7)YMPa(ksi)RTASTM D 638
Flexural Strength186 (27)Mpa (kpsi)IPC-TM-650 2.4.4
Dimensional Stability<0.5X,Ymm/m
(mils/inch)
after etch+E2/150IPC-TM-650 2.4.39A
Coefficient of Thermal Expansion10
12
31
X
Y
Z
ppm/-55to288IPC-TM-650 2.4.41
Tg>280 TMAAIPC-TM-650 2.4.24.3
Td390 TGAASTM D 3850
Thermal Conductivity0.66W/m/oK80ASTM C518
Moisture Absorption0.05%48hrs immersion 0.060"
sample Temperature 50
ASTM D 570
Density1.92gm/cm323ASTM D 792
Copper Peel Stength0.88 (5.0)N/mm (pli)after solder float 1 oz.
EDC Foil
IPC-TM-650 2.4.8
FlammabilityV-0UL 94
Lead-free Process CompatibleYes

Features and Benefits

1. Significantly improved oxidation resistance compared to typical thermoset microwave materials, which are designed for performance sensitive, high volume applications.

2. Low loss exhibits excellent electrical performance allowing application with higher operating frequencies, especially ideal for automotive applications.

3. Tight dielectric constant tolerance results in controlled impedance transmission lines

4. Lead-free process compatible results in no blistering or delamination

5. Low Z-axis expansion results in reliable plated through holes

6. Low in-plane expansion coefficient remains stable over an entire range of circuit processing temperatures

7. CAF resistant


Our PCB Capability (RO4835)

PCB Material:Hydrocarbon Ceramic Laminates
Designation:RO4835
Dielectric constant:3.48 (10 GHz)
Dissipation Factor0.0037 (10 GHz)
Layer count:Double Sided PCB, Multilayer PCB, Hybrid PCB
Copper weight:0.5oz (17 µm), 1oz (35µm), 2oz (70µm)
Dielectric thickness (ED copper)6.6mil (0.168mm), 10mil (0.254mm), 20mil (0.508mm), 30mil (0.762mm), 60mil (1.524mm)
Dielectric thickness (LoPro copper)4mil (0.102mm), 7.3mil (0.186mm), 10.7mil (0.272mm), 20.7mil (0.526mm), 30.7mil (0.780mm), 60.7mil (1.542mm)
PCB size:≤400mm X 500mm
Solder mask:Green, Black, Blue, Yellow, Red etc.
Surface finish:Bare copper, HASL, ENIG, Immersion silver, Immersion tin, OSP, Pure gold plated etc..

Typical Applications:

1. Automotive Radar and Sensors

2. Point-to point Microwave

3. Power Amplifiers

4. Phased - Array Radar

5. RF Components




Products Application:

1, Telecom Communication
2, Consumer Electronics
3, Security monitor
4, Vehicle Electronices
5, Smart Home
6, Industrial controls
7, Military & Defense

8, Automotive

9, Smart Home

10, Industrial Automation

11, Medical Devices

12, New Energy

And so on

Buy RO4835 Rogers RF PCB Board 30mil ED Copper Multilayer at wholesale prices
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