Black ESD Plastic Stackable Waffle Pack Chip Tray Ultra Clean

Ultra Clean Black ESD Plastic Stackable Waffle Pack Chip Tray

The waffle pack chip tray is widely used by customers in the semiconductor and electronics industries,Who have high requirements for cleanliness and size of products. From the design drawing, mold manufacturing, product manufacturing to cleaning and packaging and so on, all the steps and operations are strictly quality control. Our ultimate goal is to deliver products that satisfy our customers.

We can customize various specifications and sizes of trays according to customer needs. Recommend the most reasonable loading solution for customers, and multiple trays can be overlapped, increase the storage of electronic components, PCB board, dust-free workshop parts, and saves production costs.

The Details of the HN21109 Black 2 Inch Waffle Pack

The HN21109 waffle packs are trays made of plastic. This material can be recycled and easily degraded after being damaged and abandoned, so customers don't have to worry about environmental production issues.

At the same time, it is small in size, light in weight, low in transportation cost, suitable for transferring or loading samples for testing. Hiner-pack also produces matching lids and clamps that can fit with packs for all types of shipping.

Application of the HN21109 Black 2 inch Waffle Pack

Wafer Die / Bar / Chips PCBA module component
Electronic component packaging Optical device packaging

Service Of IC Tray Manufacturer

1. We have sample stock, also can help the client to choose which type is suitable for them.
2. We will reply you in any time if you have questions.
3. Choose suitable product for clients according to clients' requirement.
4. After mold customization, free samples will be provided until the customer tests OK, so as to remove the mass production quality concerns of customers before quantity.

FAQ Of Hiner-pack waffle pack series products

Q1: Are You Manufacturer or Trade Company?

Ans: We are the 100% Manufacturer specialized in packaging over 10 years with 4500 square meters workshop area, located in Shenzhen China.

Q2: What is the material of your product?

Ans:ABS.PC.PPE.MPPO.PEI.HIPS...etc

Q3: Can you help with the design?

Ans: Yes, we can accept your customization and do the packaging for you according to your requirement.

Q4: How can I get the quotation of the custom products ?

Ans: Let us know the size of your IC or component thickness,and then we can make a quotation for you.

Q5: Can I get some samples before making a bulk order?

Ans:Yes, the fee sample in stock can be sent, but the shipping fee should be paid by yourself.

Q6: Could you put my logo in our product?
Ans:Yes, we can put your logo in our product, show us your logo firstly please.

Q7: When can we get the samples?
Ans: We can send you them right now if you are interested in something we have stock, and customize,the project depending on the specific time.

stackable

Hiner-pack was founded in 2013, it is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services.

Hiner-pack has established a depth of cooperation with well-known enterprises and built a polymer material R&D base with domestic well-known universities as well as scientific research institutions. Hiner-pack has mastered special processing techniques and manufacturing in the semiconductor packaging raw material field. Owned a lot of inventions and practical new patents. Through years of unremitting efforts, Hiner-pack has a professional R&D team to improve semiconductor packaging products, new products continue to be launched, and to solve the customer demand for high-quality products.

Learn more through our official website: https://www.hiner-pack.com/english/