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| Categories | DDR4 PCB |
|---|---|
| Brand Name: | TOPCBS |
| Model Number: | DDR Socket PCB |
| Certification: | UL94V0 |
| Place of Origin: | Suzhou China |
| MOQ: | Negotiation |
| Price: | Negotiation |
| Payment Terms: | T/T |
| Supply Ability: | 10000unit per month |
| Delivery Time: | 10-14working days |
| Packaging Details: | 20unit per package package size:20*15*10cm |
| Name: | DDR Socket PCB |
| Layer count: | 10Layer |
| Board Thickness: | 2.0mm |
| Vias: | Blind vias，Buried vias,Fill Cu vias |
| Stack up: | 10L anylayer ,4-2-4 |
| Finish treatment: | Immersion gold |
| Unit size: | 23.6*23.6mm(L*W) |
| Pitch size: | 0.3mm |
| Surface treatment: | Immersion gold |
Android Linux Motherboard Apply For Multifunction Prototype Pcb
1. Strong engineering group and R&D team
2. Conformal coating available to extend product life
3. Test: AOI, In-Circuit Test (ICT), Functional Test (FCT), FAI and
Final products test
4. IC programming
5. 30% discount of PCBA service cost for PCBA prototype order,or
refund all PCBA service cost when placing mass-production PCBA
order.
6. No MOQ and quick delivery
7. 9 advanced SMT lines 2 DIP lines
2 . Specifications:
| Name | 2.0mm LPDDR4 interposer PCBs |
| Number of Layers | 4-2-4 Layers |
| Quality Grade | IPC 6012 Class 2,IPC 6012 Class 3 |
| Material | Lead Free materials |
| Thickness | 2.0mm |
| Min Track/Spacing | 3/3mil |
| Min Hole Size | 0.075mm laser drilling |
| Solder Mask | Green |
| Silkscreen | White |
| Surface Finish | Immersion gold |
| Finished Copper | 1OZ |
| Lead time | 28-35 days |
| Quick turn service | Yes |
Descriptions:
What is the PCB Layout Changes Needed for DDR4 Implementation?
DDR4 or Double Data Rate 4 comes in two distinct module types. So-DIMM or small outline dual in-line memory modules (260-pins) that are in use in portable computing devices like laptops. The other module type is DIMM or dual in-line memory modules (288-pins) that are in use in devices like desktops and servers.
So, the first change in architecture is, of course, due to the pin count. The previous iteration (DDR3) uses 240-pins for a DIMM and 204-pins for a So-DIMM. Whereas the previously mentioned, DDR4 uses 288-pins for its DIMM application. With the increase in pins or contacts, DDR4 offers higher DIMM capacities, enhanced data integrity, faster download speed, and an increase in power efficiency.
Accompanying this overall improvement in performance is also a curved design (bottom) that enables better, more secure attachment, and it improves stability and strength during installation. Also, there are bench tests that confirm that DDR4 offers a 50% increase in performance and can achieve up to 3,200 MTs (Mega Transfers per Second).
Furthermore, it achieves these increases in performance in spite of using less power; 1.2 volts (per DIMM) instead of the 1.5 to 1.35-volt requirement of its predecessor. All of these changes mean that the PCB designers must reassess their design approach for the implementation of DDR4.
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