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Tiny Size 640x512 Resolution 12μm Pixel Pitch Uncooled Infrared Camera Core for Forest Firefighting

Categories Thermal Security Camera
Power Consumption: 0.5W
Pixel Pitch: 12μm
Typical NETD: ≤40mK
Frame Rate: 25/30Hz/50Hz
Spectral Range: 8~14μm
Brand Name: SensorMicro
Model Number: iTL612 Pro
Certification: ISO9001:2015; RoHS; Reach
Place of Origin: Wuhan, Hubei Province, China
MOQ: 1 Piece
Price: Negotiable
Payment Terms: T/T
Resolution: 640x512
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Tiny Size 640x512 Resolution 12μm Pixel Pitch Uncooled Infrared Camera Core for Forest Firefighting

640*512/12μm Uncooled Infrared Camera Core Tiny Size for Forest Firefighting
Product Overview

As a leading manufacturer of cooled and uncooled infrared detectors and thermal modules, SensorMicro has developed the iTL612Pro - a compact, lightweight infrared thermal imaging core. This advanced version builds upon the proven iTL612 platform with enhanced size and weight optimization.

Designed specifically for SWaP-C (size, weight, power, and cost) optimization, the iTL612 Pro infrared camera core sets industry standards for compact dimensions and minimal weight. It represents the ideal solution for integrators with strict size and weight requirements for their product designs.

Featuring a 640*512/12μm self-developed wafer-level infrared detector, IP67-rated lens protection, and comprehensive SDK solutions, the iTL612 Pro thermal module delivers exceptional performance in constrained spaces while achieving extended battery life through ultra-low power consumption.

Main Features
  • Unmatched Lightness and Minimal Load
    • Ultra-Miniature Size: 17.3*17.3*23.4 mm (including 9.1 mm lens)
    • Ultra-Lightweight: 13.7±0.5g (including 9.1 mm lens)
    • Ultra-Low Power Consumption: As low as 0.5W
  • Mainstream FPA with Clear Imaging
    • 640*512 Resolution for widespread integration
    • Enhanced Image Clarity: Multiple new-generation image algorithms for improved image quality
  • Easy Development & Seamless Integration
    • Multiple lens options available to suit various application scenarios
    • Supports multiple image output interfaces: DVP8, LVDS, MIPI, USB 2.0, and BT.656
    • RAW/YUV/Matrix-TEMP data output with serial port control
Product Specifications
ModeliTL612Pro
IR Detectors Indicators
Sensitive MaterialVOx
Resolution640*512
Pixel Size12μm
Spectral Response8μm ~ 14μm
Typical NETD≤40mK
Image Processing
Digital Frame Rate25/30Hz/50Hz
Start-up Time≤5s
Digital VideoRAW/YUV/Matrix-TEMP
Image AlgorithmNUC/3DNR/DNS/DRC/EE
Image Display10 (Black Hot/White Hot/Pseudo Color)
Electrical
Standard External Interface30Pin_HRS interface: DF40C-30DP-0.4V(51)
MIPI External Interface34Pin_Panasonic Connector Interface: AXE634124
Communication InterfaceTTL-232/USB2.0
Digital Video InterfaceDVP8/LVDS/MIPI/USB2.0/BT.656
Supply Voltage4.2-5.5V
Typical Power Consumption0.5W
Mechanical
Size (including lens)17.3*17.3*23.4 (9.1mm lens)
17.3*17.3*30.2 (13mm lens)
17.3*17.3*38 (25mm lens)
17.3*17.3*54 (45mm lens)
Weight (including lens)13.7±0.5g (9.1mm lens)
20±0.5g (13mm lens)
27.3±0.5g (25mm lens)
51±0.5g (45mm lens)
Environmental Adaptability
Operating Temperature-40℃~+70℃
Storage Temperature-45℃~+85℃
Humidity5%~95%, non-condensing
VibrationSine Vibration, Frequency: 10HZ~150HZ~10HZ, Peak Value: 0.15mm, Axial Direction: X, Endurance Time: 8min/axis, Cycles: 2 times
ImpactHalf Sine Wave, 30g/11ms, Impact Direction X Axis, 3 times
CertificationROHS2.0/REACH
Optical LensFixed Focus Athermal: 9.1/13/25/45mm
Industrial Applications

The iTL612 Pro thermal imaging module is designed for integration into various wearable devices and systems with strict size and weight requirements. It finds extensive application in:

  • Forest Firefighting
  • Power Maintenance
  • Photovoltaic Inspection
  • Security Monitoring
  • Wearable Devices
  • Portable Devices
Your Trusted Partner in Infrared Sensing
  • Deep Technical Expertise

    With many years of experience in research, development, and application of infrared sensor technology, we possess strong capabilities across chip design, wafer fabrication, packaging and testing, and system integration.

  • Focused on Innovation and Practical Implementation

    We drive technological breakthroughs in thermal imaging, constantly advancing NETD, SWaP, and operating temperature parameters to maintain leadership across security, industrial monitoring, and intelligent systems applications.

  • Diversified Product Portfolio

    Backed by independent R&D and multiple technical pathways, we offer comprehensive infrared detection solutions—both cooled and uncooled—tailored for diverse industrial applications.

  • Rigorous Reliability Validation

    Supported by robust quality management systems, our products undergo extensive testing throughout production to ensure long-term stability and reliability.

  • Professional Technical Support

    Our engineering teams collaborate closely with customer R&D and product teams to accelerate system integration, improve efficiency, and reduce time-to-market.

Frequently Asked Questions
How to choose proper infrared detector resolution?

Selection depends on actual application requirements and budget considerations. For applications where image quality is not critical, lower resolution detectors (120*90, 256*192, 400*300) may suffice. For applications requiring high clarity, such as remote monitoring, higher resolution detectors (1280*1024) are recommended.

How to select right pseudo color for thermal imaging?

• Gray-white palette: Ideal for targets with small temperature differences
• Red and blue palette: Suitable for identifying problem points in scenes
• Iron red palette: Standard color scheme for power industry applications
Note: Temperature measurements remain consistent regardless of color palette selection.

How to choose a suitable infrared thermal camera lens?

• Standard lens: Suitable for normal targets at appropriate distances
• Telephoto lens: Ideal for small targets viewed from long distances
• Wide angle lens: Provides more detail for objects at close distances
• Macro lens: Designed for very small targets at close range, such as chip circuits

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