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Rogers RO3010 Microwave PCB Board 2-Layer Rogers 3010 25mil 0.635mm Circuit Board DK10.2 DF 0.0022 High Frequency PCB

Categories Rogers PCB Board
Brand Name: Bicheng Technologies Limited
Model Number: BIC-0049-V0.86
Certification: UL
Place of Origin: China
MOQ: 1
Price: USD 2.99-9.99 PER PIECE
Payment Terms: T/T, Western Union
Supply Ability: 45000 pieces per month
Delivery Time: 10 working days
Packaging Details: Vacuum
Number of Layers: 2
Glass Epoxy: RO3010
Final foil: 1.0 Oz
Final height of PCB: 0.7 mm ±10%
Surface Finish: Immersion Gold
Solder Mask Color: Green
Colour of Component Legend: White
Test: 100% Electrical Test prior shipment
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Rogers RO3010 Microwave PCB Board 2-Layer Rogers 3010 25mil 0.635mm Circuit Board DK10.2 DF 0.0022 High Frequency PCB

Rogers RO3010 Microwave PCB Board 2-Layer Rogers 3010 25mil 0.635mm Circuit Board DK10.2 DF 0.0022 High Frequency PCB

(Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)


Rogers RO3010 high frequency circuit materials are ceramic-filled PTFE composites intended for use in commercial microwave and RF applications. It was designed to offer exceptional electrical and mechanical stability at competitive prices. The mechanical properties are consistent. This allows the designer to develop multi-layer board designs without encountering warpages or reliability problems. RO3010 materials exhibit a coefficient of thermal expansion(CTE) in the X and Y axis of 17 ppm/℃. This expansion coefficient is matched to that of copper, which allows the material to exhibit excellent dimensional stability, with typical etch shrinkage, after etch and bake, of less than 0.5 mils per inch. The Z-axis CTE is 24 ppm/℃, which provides exceptional plated through-hole reliability, even in severe environments.


Typical applications:

1) Automotive radar

2) Cellular telecommunications systems

3) Datalink on cable systems

4) Direct broadcast satellites

5) Global positioning satellite antennas

6) Patch antenna for wireless communications

7) Power amplifiers and antennas

8) Power backplanes

9) Remote meter readers



PCB Specifications

PCB SIZE100 x 100mm=1PCS
BOARD TYPEDouble sided PCB
Number of Layers2 layers
Surface Mount ComponentsYES
Through Hole ComponentsYES
LAYER STACKUPcopper ------- 18um(0.5 oz)+plate TOP layer
RO3010 0.635mm
copper ------- 18um(0.5 oz) + plate BOT Layer
TECHNOLOGY
Minimum Trace and Space:6 mil / 6 mil
Minimum / Maximum Holes:0.3mm / 1.5mm
Number of Different Holes:n/a
Number of Drill Holes:n/a
Number of Milled Slots:0
Number of Internal Cutouts:0
Impedance Control:no
Number of Gold finger:0
BOARD MATERIAL
Glass Epoxy:RO3010 0.635mm
Final foil external:1oz
Final foil internal:N/A
Final height of PCB:0.8 mm ±0.1mm
PLATING AND COATING
Surface FinishImmersion Gold
Solder Mask Apply To:Bottom, 12micron Minimum
Solder Mask Color:Green, PSR-2000GT600D, Taiyo Supplied.
Solder Mask Type:LPSM
CONTOUR/CUTTINGRouting
MARKING
Side of Component LegendBottom
Colour of Component LegendWhite, IJR-4000 MW300, Taiyo brand
Manufacturer Name or Logo:Marked on the board in a conductor and leged FREE AREA
VIAN/A
FLAMIBILITY RATINGUL 94-V0 Approval MIN.
DIMENSION TOLERANCE
Outline dimension:0.0059"
Board plating:0.0029"
Drill tolerance:0.002"
TEST100% Electrical Test prior shipment
TYPE OF ARTWORK TO BE SUPPLIEDemail file, Gerber RS-274-X, PCBDOC etc
SERVICE AREAWorldwide, Globally.


Data Sheet of Rogers 3010 (RO3010)

RO3010 Typical Value
PropertyRO3010DirectionUnitsConditionTest Method
Dielectric Constant,εProcess10.2±0.05Z10 GHz/23℃IPC-TM-650 2.5.5.5 Clamped Stripline
Dielectric Constant,εDesign11.2Z8GHz to 40 GHzDifferential Phase Length Method
Dissipation Factor,tanδ0.0022Z10 GHz/23℃IPC-TM-650 2.5.5.5
Thermal Coefficient of ε-395Zppm/℃10 GHz -50℃to 150℃IPC-TM-650 2.5.5.5
Dimensional Stability0.35
0.31
X
Y
mm/mCOND AIPC-TM-650 2.2.4
Volume Resistivity105MΩ.cmCOND AIPC 2.5.17.1
Surface Resistivity105COND AIPC 2.5.17.1
Tensile Modulus1902
1934
X
Y
MPa23℃ASTM D 638
Moisture Absorption0.05%D48/50IPC-TM-650 2.6.2.1
Specific Heat0.8j/g/kCalculated
Thermal Conductivity0.95W/M/K50℃ASTM D 5470
Coefficient of Thermal Expansion
(-55 to 288℃)
13
11
16
X
Y
Z
ppm/℃23℃/50% RHIPC-TM-650 2.4.4.1
Td500℃ TGAASTM D 3850
Density2.8gm/cm323℃ASTM D 792
Copper Peel Stength9.4Ib/in.1oz,EDC After Solder FloatIPC-TM 2.4.8
FlammabilityV-0UL 94
Lead-free Process CompatibleYes
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