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Rogers RO3010 High Frequency Printed Circuit Board PCB Rogers DK10.2 Antenna PCB

Categories Rogers PCB Board
Brand Name: Bicheng Technologies Limited
Model Number: BIC-0097-V1.37
Certification: UL
Place of Origin: China
MOQ: 1
Price: USD 9.99-99.99
Payment Terms: T/T, Paypal
Supply Ability: 50000 pieces per month
Delivery Time: 10 working days
Packaging Details: Vacuum
Number of Layers: 2 Layer, Multilayer, Hybrid PCB
Glass Epoxy: RO3010
Final height of PCB: 5mil (0.127mm), 10mil (0.254mm), 25mil (0.635mm), 50mil (1.27mm)
Final foil external: 0.5oz, 1oz, 2oz
Surface Finish: Bare copper, HASL, ENIG, OSP etc..
Solder Mask Color: Green, Black, Blue, Yellow, Red etc.
Colour of Component Legend: Green, Black, Blue, Yellow, Red etc.
Test: 100% Electrical Test prior shipment
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Rogers RO3010 High Frequency Printed Circuit Board PCB Rogers DK10.2 Antenna PCB

Hello Everyone,

Today we’re talk about RO3010 high frequency PCBs.


RO3010 high frequency circuit laminates are ceramic-filled PTFE composites intended for using in commercial microwave and RF applications. Its obvious characteristic is that the electrical performance is exceptional and the mechanical property is stable and consistent. This allows our designer to develop multi-layer board without encountering warpage or reliability problems.


More features and applications are as follows:

1, Excellent mechanical properties versus temperature, it’s reliable stripline and multi-layer board constructions.

2, Uniform mechanical properties, it’s suitable for use with epoxy glass multi-layer board hybrid designs.

3, Low in-plane expansion coefficient matches to copper, it allows for more reliable surface mounted assemblies; ideal for applications sensitive to temperature change and exhibit excellent dimensional stability.


PCB Capability
PCB Material:Ceramic-filled PTFE composite
Designation:RO3010
Dielectric constant:10. 2 ±0.3 (process)
11.2 (design)
Layer count:2 Layer, Multilayer, Hybrid PCB
Copper weight:0.5oz (17 µm), 1oz (35µm), 2oz (70µm)
PCB thickness:5mil (0.127mm), 10mil (0.254mm),
25mil (0.635mm), 50mil (1.27mm)
PCB size:≤400mm X 500mm
Solder mask:Green, Black, Blue, Yellow, Red etc.
Surface finish:Bare copper, HASL, ENIG, OSP etc..
  

RO3010 high frequency PCBs are available with double sided, multi-layer and hybrid construction, 0.5oz to 2oz finished copper, 0.13 mm to 1.3mm thick, maximum size 400 mm by 500mm, surface finish with bare copper, hot air leveling, immersion gold etc.


Typical applications are

1. Automotive radar applications

2. GPS Antennas

3. Power amplifiers and antennas

4. Patch antennas for wireless communications

5. Direct broadcast satellite

The basic colour of RO3010 PCB is white.


The manufacturing process of RO3010 high frequency PCB is similar to standard PTFE PCB, so it’s suitable for volume manufacturing process winning advantageous market. Should you have any questions, please feel free to contact us.

Thank you for your reading.


Appendix: Typical Value of RO3010

PropertyRO3010DirectionUnitsConditionTest Method
Dielectric Constant,εProcess10.2±0.05Z10 GHz/23IPC-TM-650 2.5.5.5 Clamped Stripline
Dielectric Constant,εDesign11.2Z8GHz to 40 GHzDifferential Phase Length Method
Dissipation Factor,tanδ0.0022Z10 GHz/23IPC-TM-650 2.5.5.5
Thermal Coefficient of ε-395Zppm/10 GHz -50to 150IPC-TM-650 2.5.5.5
Dimensional Stability0.35
0.31
X
Y
mm/mCOND AIPC-TM-650 2.2.4
Volume Resistivity105MΩ.cmCOND AIPC 2.5.17.1
Surface Resistivity105COND AIPC 2.5.17.1
Tensile Modulus1902
1934
X
Y
MPa23ASTM D 638
Moisture Absorption0.05%D48/50IPC-TM-650 2.6.2.1
Specific Heat0.8j/g/kCalculated
Thermal Conductivity0.95W/M/K50ASTM D 5470
Coefficient of Thermal Expansion
(-55 to 288
)
13
11
16
X
Y
Z
ppm/23/50% RHIPC-TM-650 2.4.4.1
Td500 TGAASTM D 3850
Density2.8gm/cm323ASTM D 792
Copper Peel Stength9.4Ib/in.1oz,EDC After Solder FloatIPC-TM 2.4.8
FlammabilityV-0UL 94
Lead-free Process CompatibleYes
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