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RTduroid 5870 PCB 31mil DK 2.33 Double Sided 1oz Copper No metalization (Bare Copper)

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Brand Name: Bicheng Enterprise Limited
Model Number: BIC-329-V4.11
Certification: UL
Place of Origin: CHINA
MOQ: 1 PIECE
Price: USD40~50
Payment Terms: T/T,Paypal
Supply Ability: 50000 PIECE PER MONTH
Delivery Time: 8-9 WORKING DAY
Packaging Details: VACUUM
Board Material: Polyimide 50µm,ITEQ
Board Thickness: 0.25mm
Surface/Inner layer Cu thickness: 35 µm/35 µm
Surface Finish: Immersion Gold
Coverlay Colour: Yellow
Color of Silkscreen: White
Function: 100% Pass electrical test
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RTduroid 5870 PCB 31mil DK 2.33 Double Sided 1oz Copper No metalization (Bare Copper)

Bring Superior Performance to High Frequency Circuits with Rogers RT/duroid 5870 PCB


Engineers rejoice! We are proud to offer our new 2-layer PCB featuring Rogers RT/duroid 5870 glass microfiber reinforced PTFE composite material - engineered to deliver unmatched electrical performance for your most demanding RF circuit designs.


Key Features:

  • Rogers 5870 core with best-in-class Dk of 2.33 and ultra-low dissipation factor of 0.0012 at 10 GHz
  • 2-layer construction with 6/5 mil minimum trace/space allowing for high density GHz circuit design
  • Bare copper finish on outer layers for maximum routing flexibility prior to component placement
  • Highly consistent electrical performance from DC to 10 GHz due to the isotropic and homogeneous composition of the Rogers 5870 material

The virgin material cuts and machines with ease, resists chemicals, and prevents moisture absorption - ideal for prototyping and small production runs. Exposed copper traces and vias allow for post-etching and surface mount soldering flexibility. The first panel sized at 45mm x 51mm houses 19 components across 4 nets, interconnected on a controlled 50 ohm impedance transmission line.


Advantages

  • Lowest loss of any glass microfiber substrate, maximizing power efficiency and signal integrity.
  • Flexible 6/5 milfeature spacing accommodates demanding high-density designs.
  • Bare copper finish allows for full routability prior to assembly.
  • Off-the-shelf availability reduces developmenttime versus custom solutions.

Potential Disadvantages

  • Increased material cost versus FR-4 could limit use in high-volume production.
  • Thickness tolerance of ±15 mils may impact tightly-coupled microstrip designs.
  • Lack of soldermask/silkscreen finishing requires manual assembly and inspection steps.
  • Limited to 2 layers versus multilayer options, restricting 3D routing complexity.

Some Typical Applications:
- Commercial Airline Broadband Antennas
- Microstrip and Stripline Circuits
- Millimeter Wave Applications
- Radar Systems
- Guidance Systems
- Point to Point Digital Radio Antennas


For engineers seeking to push boundaries in RF innovation, this PCB provides the optimal foundation for success. Contact us to discuss leveraging Rogers RT/duroid 5870 on your next project!


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