Optoelectronic Components Packaging Trays Bare Die

Optoelectronic Components Packaging Trays Bare Die

Durable Antistatic ABS Bare Die Tray With Different Size For Optoelectronic Components

Hiner pack designs trays for any type of component, module, MEMS, or device, and it need not be in a JEDEC format. Working with application requirements, engineering principles, materials technology, and manufacturing best practices, a custom solution may be the best value for your business.

Custom molded tray will develop a custom pocket design to handle and protect your sensitive and micro devices. Trays are then CNC machined to the specific configuration for your part.

As the tray in the field of optical application, more and more customers in order to protect components or optical devices, are willing to choose injection molding tray for packaging solution, because the tray can carrier component also provides comprehensive protection to transit and transport provides great convenience, all kinds of specifications and various color can be realized,Provide one-stop service from design to production to packaging.

Product Application

Wafer Die / Bar / Chips PCBA module component

Electronic component packaging Optical device packaging

Packaging

Packaging Details:Packing according to customer's specified size

Advantages

1. Flexible OEM service: we can produce products according to customer’s sample or design.

2. Various Materials: the material can be MPPO.PPE.ABS.PEI.IDP...etc.

3. Complicated workmanship: tooling making, Injection molding,Production

4. Comprehensive customer service: from customer consultation to after sales service.

5. 10 years’ex perience of OEM for USA and EU customers.

6. We have our own factory and can control quality in high level and produce products quickly and flexibly.

FAQ

Q1. Why Choose us?
Wallis insist strict QC during producing, product performance are ensured.
Strong technical team-quick to solve problems, creative to design new items, latest RFID items .
Big capacity-cost-effective and flexible to adjust production for volume and urgent orders.
10-year factory experienced in all crafts, and with strong customization capacity, satisfy your requirement to the best.
Having long-term and stable material suppliers, sources are trust-able and time-effective.
Owning professional agents of shipping. Goods reach to you fast, save and cost-effective.

Q2. Can I order if quantity less than MOQ?
Yes and it would be taken as sample order to production. We take more serious on sample order.

Q3. Can I get Free Samples?
Yes, If samples we have in stock would be provided for testing, but shipment should at your side.
If samples are needed to customize with your logo and designs, please send us designs and advise chip, quantity, and any other details required. Thank you.

Q4. Do you arrange shipment for the products?

It’s depends on our incoterms,If FOB or CIF price, we will arrange shipment for you, but EXW price, clients need to arrange shipment by themselves or their agents.

Hiner-pack was founded in 2013, it is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services.

Hiner-pack has established a depth of cooperation with well-known enterprises and built a polymer material R&D base with domestic well-known universities as well as scientific research institutions. Hiner-pack has mastered special processing techniques and manufacturing in the semiconductor packaging raw material field. Owned a lot of inventions and practical new patents. Through years of unremitting efforts, Hiner-pack has a professional R&D team to improve semiconductor packaging products, new products continue to be launched, and to solve the customer demand for high-quality products.

Learn more through our official website: https://www.hiner-pack.com/english/