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Thermal Conductive Gap Pad 20±5 Shore 00 3.0 W/M-K For Mainboard/Mother Board

Categories Thermal Gap Pad
Brand Name: ZIITEK
Model Number: TIF1160-30-11US
Certification: UL and RoHs
Place of Origin: China
MOQ: 1000pcs
Price: negotiation
Supply Ability: 100000pcs/day
Delivery Time: 3-5 work days
Packaging Details: 1000pcs/bag
Heat Capacity: 1 l/g-K
Thermal conductivity: 3.0 W/m-K
Hardness: 20±5 Shore 00
Density: 3.0 g/cc
Continuos Use Temp: -40 to 160℃
Flame rating: 94 V0
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Thermal Conductive Gap Pad 20±5 Shore 00 3.0 W/M-K For Mainboard/Mother Board

High cost-effective thermal conductive gap pad 20±5 Shore 00,3.0 W/m-K for mainboard/mother board


The TIF1160-30-11US is an extremely soft gap filling material rated at a thermal conductivity of 3.0 W/m-K. It is specially formulated for high performance applications requiring low assembly stress. The material offers exceptional thermal performance at low pressures due to the unique filler package and ultra low modulus resin formulation. TIF1160-30-11US is highly conformal to rough or irregular surfaces, allowing excellent wet-out at the interface. Protective liners are supplied on both sides allowing for ease of use.


TIF100-30-11US-Series-Datasheet-.pdf


Features


> Good thermal conductive: 3.0 W/mK

>Thickness:4.0mmT

>hardness:20±5 shore00

>Colour: gray

>Fiberglass reinforced for puncture, shear and tear resistance

>Easy release construction

>Electrically isolating


Applications


>Memory Modules

>Mass storage devices

>Automotive electronics

>Set top boxes

>Monitoring the Power Box

>AD-DC Power Adapters

>Rainproof LED Power


Typical Properties of TIF1160-30-11US Series
Color
gray
Visual
Composite Thickness
Thermal Impedance@10psi
(℃-in²/W)
Construction &
Compostion
Ceramic filled silicone rubber
***
10mils / 0.254 mm
0.16
20mils / 0.508 mm
0.20

Specific gravity

3.0g/cc
ASTM D297
30mils / 0.762 mm
0.31
40mils / 1.016 mm
0.36
Thickness
4.0mmT
***
50mils / 1.270 mm
0.42
60mils / 1.524 mm
0.48
Hardness
20±5 Shore 00
ASTM 2240
70mils / 1.778 mm
0.53
80mils / 2.032 mm
0.63
Outgassing(TML)
0.35%
ASTM E595
90mils / 2.286 mm
0.73
100mils / 2.540 mm
0.81
Continuos Use Temp
-40 to 160℃
***
110mils / 2.794 mm
0.86
120mils / 3.048 mm
0.93
Dielectric Breakdown Voltage
>5500 VAC
ASTM D149
130mils / 3.302mm
1.00
140mils /3.556 mm
1.08
Dielectric Constant
4.0 MHz
ASTM D150
150mils / 3.810 mm
1.13
160mils / 4.064 mm
1.20
Volume Resistivity
1.0X1012
Ohm-cm
ASTM D257
170mils / 4.318 mm
1.24
180mils / 4.572 mm
1.32
Fire rating
94 V0
equivalent
UL
190mils / 4.826 mm
1.41
200mils / 5.080 mm
1.52
Thermal conductivity
3.0 W/m-K
ASTM D5470
Visua l/ ASTM D751
ASTM D5470

Company Profile

Ziitek company is a high-tech enterprise which dedicated to the R&D, manufacture and sales of the thermal interface materials (TIMs). We have rich experiences in this field which can support you the latest, most effective and one -step thermal management solutions. We have many advanced production equipments,full test equipments and fully automatic coating production lines which can support the production for high performance thermal silicone pad, thermal graphite sheet/ film, thermal double-sided tape, thermal insulation pad, thermal ceramic pad, phase change material, thermal grease etc. UL94 V-0, SGS and ROHS are compliant.


Peressure Sensitive Adhesive:

Request adhesive on one side with "A1" suffix.

Request adhesive on double side with "A2" suffix.


Reinforcement: TIF™ series sheets type can add with fiberglass reinforced.


FAQ

Q: Do you provide samples ? is it free or extra cost?

A: Yes, we could offer samples free of charge


Q:Is there promotion price for big buyer?

A:Yes, we do have promotion price for big buyer. Please send us email for inquiry.

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