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Tungsten Copper CuW BTF Package Baseplate , CuMo Copper Molybdenum Heat Sink

Categories Hermetic Packages Electronics
Brand Name: JBNR
Model Number: 50MoCu,60MoCu,70MoCu,85MoCu
Place of Origin: CHINA
Payment Terms: L/C, , T/T, Western Union
Delivery Time: 15days
Packaging Details: as customer required
MOQ: Negotiation
Price: Negotiable
Material: tungsten copper
Density: 16.4
CTE: 7.2
TC: 185
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Tungsten Copper CuW BTF Package Baseplate , CuMo Copper Molybdenum Heat Sink

Tungsten Copper CuW BTF Package Baseplate , CuMo Copper Molybdenum Heat Sink


Description:


CuW heat sink material is a composite of tungsten and copper, with both tungsten low expansion characteristics, but also has copper of high thermal conductivity properties, and the tungsten and copper in the thermal expansion coefficient and thermal conductivity can be adjusted with the W-Cu composition, also the composite can be machined to various shape.


CuMo composite is similar with Tungsten-Copper composite, its thermal expansion coefficient and thermal conductivity can be adjusted to match many different materials, it has lower density, but its CTE is higher than W-Cu.


Advantages:


1. High thermal conductivity

2. Excellent hermeticity

3. Excellent flatness, surface finish, and size control

4. Semi-finished or finished (Ni/Au plated) products available

5. Low void


Product Properties:


GradeW ContentDensity g/cm3

Coefficient of thermal

Expansion ×10-6 (20℃)

Thermal conductivity W/(M·K)
90WCu90±2%17.06.5180 (25℃) /176 (100℃)
85WCu85±2%16.47.2190 (25℃) / 183 (100℃)
80WCu80±2%15.658.3200 (25℃) / 197 (100℃)
75WCu75±2%14.99.0230 (25℃) / 220 (100℃)
50WCu50±2%12.212.5340 (25℃) / 310 (100℃)
GradeMo ContentDensity g/cm3

Coefficient of thermal

Expansion ×10-6 (20℃)

Thermal conductivity W/(M·K)
85MoCu85±2%10.07160(25℃)/156(100℃)
70MoCu70±2%9.87200(25℃)/196(100℃)
60MoCu60±2%9.667.5222(25℃)/217(100℃)
50MoCu50±2%9.510.2250(25℃)/220(100℃)

Application:


These composite are widely used in applications such as Optoelectronics Packages, Microwave Packages, C Packages, Laser Sub-mounts, etc.


Product picture:

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