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| Categories | FR4 PCB Board |
|---|---|
| Brand Name: | JIETENG |
| Model Number: | PCBA |
| Certification: | ISO/TS16949/RoHS/TS16949 |
| Place of Origin: | Guangdong, China |
| MOQ: | Negotiable |
| Price: | Negotiable |
| Payment Terms: | Negotiable |
| Supply Ability: | 150000 Square Meter/Square Meters per Year |
| Delivery Time: | 5-8 days for delivery |
| Packaging Details: | Inner vacuum packing, outer standard carton |
| Base Material: | FR4 ,Any specialized material as per your choice |
| Copper Thickness: | 0.3- 6OZ |
| Board Thickness: | 0.3 mm- 4 mm |
| Min. Hole Diameter: | 0.2 mm |
| Min. Line Width: | 0.1 mm |
| Min. Line Spacing: | 0.1 mm |
If desired, we will source, organise and manage all aspects of the PCB design, so that your product meets all required standards and is fully optimised for easy and cost effective manufacturing. A well designed circuit board means: · A reduction in production problems · Improved quality control · Reduced costs · Reduced manufacturing times
| Our advantage | ||
| Material Technology | Our Production | General Production |
| Regular/Special | 1. Our (TG170)FR4: high quality materials, excellent heat resistance, won't distort break in high temperature, no foaming, no burning, good performance in electrical charge, impact resistance, humidity-resistance 2. Our FR4 good performance in electrical charge, impact resistance, humidity-resistance 3. Our CEM no-burr 4. Our Rogers Good performance in high frequency 5. Our Aluminum Excellent heat dispersion | 1.General FR4 High heat work 2.General CEM Expand and deform in damp conditions |
| Factory | We have automatic production line. The automatic production line
improves the precision and efficiency of PCB producing,it makes surface brighter, cleaner and more smooth, and it helps reduce the cost. | Artificial production line |
| Blind/buried via board, High Density Interconnect(1+1,N+1) | Application of HDI technology reducing the thickness and the volume of PCB boards, increasing the density of 3-D wiring design. | Difficult manufacturer, high cost |
| Impedance | Good performance in reliability and stability of signal sending and receiving | High cost |
| Surface Technics | 1. IMG:smooth surface, good adhesion, no oxidation under long using 2. gold plating(thick gold:1-50U"):good wear-resistance 3. HASL:better price, not easy oxidation, easy to welding, smooth surface 4. HAL: better price, not easy oxidation, easy to welding | 1.IMG:high price 2.Gold plating(thick gold):high price 3.HAL:surface is not flat, not suitable for BAG packaging |
| Copper Via/Surface(20-25UM,0.5-60Z) | Laser holing: Min 0.1MM, Mechanical holing: Min 0.2MM | Hard to reach 0.1MM |
| Multilayer board(4-20 L),BGA(CPU) | BGA: high density, high performance, multifunctional, increase
thermal reliability, good performance in electroheat property, MIN width/space: 3/3MIL Multilayer board:strong microporous, high reliability | Difficult manufacturer,high cost |
| Test | To assure quality, avoid wasting after installing and scraping, save cost, save the time of rework | Careless |
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