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5297 Two Part Addition Type Potting Adhesive 1.5 W/M·K Thermal Conductive UL94V-0, White And White Two-Color Liquid, Suitable For Potting Of Photovoltaic Inverters, LED Drive Power Supplies And Others

Categories Electronic Potting Compound
Brand Name: Huitian
Model Number: 5297
Certification: UL RoHS
Place of Origin: China
MOQ: 500KG
Price: Negotiation
Payment Terms: L/C, T/T
Supply Ability: 2000T/Month
Delivery Time: 5-8 days
Packaging Details: 20kg/barrel
Chemical Composition: SIlicone
Part A Appearance: Grey fluid
Part B Appearance: White fluid
Part A Viscosity: 3,500-4,500 mPa·s
Part B Viscosity: 3,000-4,000 mPa·s
Part A Density: 2.55±0.05 g/cm³
Part B Density: 2.55±0.05 g/cm³
Mix Ratio: 1:1
Operating time: >30 mins
Gel time @25℃: ≤3 h
Gel time @80℃: 30 mins
Hardness (shore A): 30-40
Volume resistivity: ≥1.0×10^14 Ω·cm
Thermal Conductivity: 1.5 W/m·K
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5297 Two Part Addition Type Potting Adhesive 1.5 W/M·K Thermal Conductive UL94V-0, White And White Two-Color Liquid, Suitable For Potting Of Photovoltaic Inverters, LED Drive Power Supplies And Others

5297(A7B7) TDS-EN.pdf


5297 is a 1:1 two-component addition-type potting silicone rubber, with 1.5 W /m·K thermal conductive, flame retardant.


Applications
All kinds of electrical components of thermal conductivity, flame retardant potting, such as photovoltaic inverters, LED drive power.charging piles, automotive electronics, NEV power, controllers etc.


Product Features

1) High thermal conductivity and flowability

2) Both room temperature and heat curing

3) Good weather and aging resistance

4) Excellent insulation properties

5) Flame retardant UL94V-0

6) Maintains rubber elasticity from -50°C to 200°C

7) RoHS Directive


Technical parameters

Reference standard1ItemUnitValue
Properties before curing (25±2, 60±5%RH)
Q/HTXC 2Appearance (A)-Grey fluid
Appearance (B)-White fluid
GB/T2794Viscosity (A)mPa·s3,500-4,500
Viscosity (B)mPa·s3,000-4,000
GB/T13354Viscosity (A)g/cm32.55±0.05
Viscosity (B)g/cm32.55±0.05
Properties after curing (25±2, 60±5%RH, A:B=1:1)
Q/HTXC 2Operating timemin>30
Q/HTXC 2Curing time (25℃)h≤3
Q/HTXC 2Curing time (80℃)min30
GB/T 531Hardness (Shore A)--30-40
Q/HTXC 2Dielectric strengthKV/mm≥18
Q/HTXC 2Volume resistivityΩ·cm≥1.0×1014
GB/T 528-92Tensile StrengthMPa0.94
GB/T 528-92Elongation%56
GB/T 7124Shear StrengthMPa0.7
GB/T 1034Water absorption%<0.1
ISO 22007-2Thermal conductivityW/(m·K)1.5±0.1
ASTM E831CLTE @25-150℃μm/(m·℃)162.6

Cautions
Store the product in a sealed container, and keep it away from children for storage.

The glue will not cure if exposed to a certain amount of the following chemicals:

Organic compounds of N, P, and S, ionic compounds of Sn, Pb, Hg, As, etc.;

Compounds containing alkyne and polyvinyl.

To avoid the above problem, Any residual rosin on the circuit board should be wiped clean when using the glue, and use soldering tin with low lead content.

This product is non-hazardous. Please consult the MSDS of the product for safety information.


Packaging

20kg/barrel


HUITIAN Addition-type potting production line


Case Show

Magnetic Device Heat Conducting and Protection 529X Series


Huitian potting adhesive integrating the structural and thermal characteristics of magnetic devices can be tailored to match products with different modulus and heat-conducting property. It can provide good protection and thermal insulation for devices, such as inductors and transformers, effectively preventing problems such as core cracking and excessive temperature rise.


  • 1.0~4.0W/(m·K) products are optional
  • Low modulus and low CTE
  • Self-adhesion
  • Anti-poisoning
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