0.8mm TU-768 High Tg PCB Board Black Soldermask White Silkscreen ENIG

Sharing a new RF PCB made of TU-768 material. The TU-768 laminate by Taiwan Union is a high-Tg (glass transition temperature) and high thermal reliability laminate designed to meet rigorous performance requirements. It is accompanied by TU-768P, a matching prepreg for enhanced functionality. These laminates and prepregs are constructed using high-quality woven E-glass coated with an epoxy resin system, offering UV-block characteristics and compatibility with automated optical inspection (AOI) processes. The TU-768 series is well-suited for applications that demand resilience against thermal cycles and extensive assembly work. Notably, TU-768 laminates exhibit exceptional CTE (coefficient of thermal expansion), superior chemical resistance, thermal stability, and CAF (conductive anodic filament) resistance properties.

Key Features:
- Dk (dielectric constant) of 4.3 at 10GHz
- Dissipation factor of .0023 at 10GHz
- CTE x-axis of 11-15 ppm/°C, CTE y-axis of 11-15 ppm/°C
- Coefficient of thermal expansion matched to copper
- Decomposition Temperature (Td) of 350 °C TGA
- Tg (glass transition temperature) of 180°C
- High thermal reliability with T260 >60 min, T288>15 min, T300 >2 min

Benefits:
- Compatible with lead-free processes
- Excellent coefficient of thermal expansion for stability
- Anti-CAF (conductive anodic filament) property for improved reliability
- Superior chemical and thermal resistance
- Fluorescent properties enable AOI (automated optical inspection)
- Resistant to moisture-related issues

PCB Stackup:
This PCB is a 2-layer rigid PCB design with the following specifications:
- Copper_layer_1: 35 μm
- TU-768 Core: 0.76 mm
- Copper_layer_2: 35 μm

PCB Construction Details:
- Board dimensions: 47.8mm x 47.8mm (1PCS), with a tolerance of +/- 0.15mm
- Minimum Trace/Space: 4/4 mils, allowing for precise circuitry
- Minimum Hole Size: 0.2mm, providing flexibility for component placement
- No blind vias, simplifying the manufacturing process
- Finished board thickness: 0.8mm, balancing durability and compactness
- Finished Cu weight: 1oz (1.4 mils) outer layers, ensuring efficient conduction
- Via plating thickness: 20 μm, enabling reliable interconnectivity
- Surface finish: Immersion Gold, for protection and improved conductivity
- Top Silkscreen: White, facilitating component identification
- Bottom Silkscreen: None, for a clean and minimalistic appearance
- Top Solder Mask: Black, enhancing soldering and protection
- Bottom Solder Mask: None, for a simplified PCB design
- Each PCB undergoes a 100% electrical test prior to shipment, ensuring quality and functionality

PCB Statistics:
- Components: 11, providing versatility for various applications
- Total Pads: 24, facilitating component connectivity
- Thru Hole Pads: 15, enabling secure connections
- Top SMT Pads: 9, supporting surface mount technology (SMT) components
- Bottom SMT Pads: 0, indicating single-sided SMT assembly
- Vias: 7, allowing for efficient signal routing
- Nets: 2, ensuring proper connectivity

Artwork Supplied:
This PCB artwork is provided in Gerber RS-274-X format, a widely used industry standard for PCB manufacturing. This format ensures compatibility and accuracy during the fabrication process.

Quality Standard and Availability:
The PCB adheres to the IPC-Class-2 quality standard, guaranteeing high-quality manufacturing and reliability. It is available for purchase worldwide, making it accessible to customers globally.

Typical Applications:

The TU-768 PCB is widely applicable in various fields, including:
- Consumer Electronics
- Servers and workstations
- Automotive industry

With its high-Tg and thermal reliability features, the TU-768 PCB is an excellent choice for demanding electronic applications that require exceptional performance and durability.

Company Profile

Founded in 2003, Shenzhen Bicheng Electronics Technology Co., Ltd is an established high frequency PCB supplier and exporter in Shenzhen China, severing cellular base station antenna, satellite, high frequency passive components, microstrip line and band line circuit, millimeter wave equipment, radar systems, digital radio frequency antenna and other fields worldwide for 18 years. Our high frequency PCBs are mainly built on 3 high frequency material brands: Rogers Corporation, Taconic and Wangling. Dielectric constant ranges from 2.2 to 10.2 etc.

Bicheng PCB is headquartered in Shenzhen, a city with great economic vitality. Based in China, we adhere to the philosophy of servicing small and medium sized companies offering variety of circuit boards to meet the demands of market.

Main Business & PCB Applications

We maintain the highest standards which support products that exhibit exceptional quality, performance and reliability. We also have divisions of FR-4 circuit board, flexible circuits and metal core PCBs featured as prototypes, small runs to mass production. We actively research and build such high value added PCB projects as HDI, quick turn, impedance control, heavy copper and backplane board etc. This has made our PCB products generate an effective prolongation and complementation, as well as formation of integrated products line ranging from low-end to high-end.The circuit boards are used in the industries of home appliances, portable and consumable electronics, medical filed, aerospace as well as telecommunications etc.

Main Material Partners