Name: 10x1012 OhmCm Heat Sink Thermal Gap Pad 35mm Thickness
Brand: ZIITEK
Price: 1 USD

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1.0x10^12 Ohm-Cm Heat Sink Thermal Gap Pad 3.5mm Thickness

Categories	Thermal Gap Pad
Brand Name:	ZIITEK
Model Number:	TIF1140-05UF thermal pad
Certification:	UL and RoHs
Place of Origin:	China
MOQ:	1000pcs
Price:	negotiation
Supply Ability:	100000pcs/day
Delivery Time:	3-5 work days
Packaging Details:	1000pcs/bag
Continuos Use Temp:	-40 to 160℃
Construction & Compostion:	Ceramic filled silicone elastomer
Dielectric Breakdown Voltage:	>5500 VAC
keyword:	Thermal Gap Pad
Thickness:	3.5mmT
name:	1.0X10^12 Ohm-cm Moldability for Complex Parts Heat Sink Pad for Handheld Portable Electronics

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Company Info.

Dongguan Ziitek Electronic Materials & Technology Ltd.

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Product Details
Company Profile

1.0x10^12 Ohm-Cm Heat Sink Thermal Gap Pad 3.5mm Thickness

1.0X10^12 Ohm-cm Moldability for Complex Parts Heat Sink Pad for Handheld Portable Electronics

The TIF1140-05UF thermal silicone pad is a product with both performance and economy. It is a unique thermal pad with low oil permeability, low thermal resistance, high softness and high compliance.It can work stably at -40℃~160℃ and meet the requirement of UL94V0.

TIF100-05UF Datasheet-REV02.pdf

Features

> Good thermal conductive: 1.5 W/mK

>Thickness: 3.5mmT

>hardness:75 shore 00

>Colour: Blue

>Moldability for complex parts
>Soft and compressible for low stress applications
>Naturally tacky needing no further adhesive coating

Applications

>Automotive engine control units

>Telecommunication hardware

>Handheld portable electronics

>Semiconductor automated test equipment (ATE)

>CPU

>display card

Typical Properties of TIF1140-05UF Series
Color	Blue	Visual	Composite Thickness	Thermal Impedance@10psi (℃-in²/W)
Construction & Compostion	Ceramic filled silicone elastomer	***	10mils / 0.254 mm	0.16
			20mils / 0.508 mm	0.20
Specific gravity	2.2 g/cc	ASTM D297	30mils / 0.762 mm	0.31
			40mils / 1.016 mm	0.36
Thickness	3.5mmT	***	50mils / 1.270 mm	0.42
			60mils / 1.524 mm	0.48
Hardness	75 Shore 00	ASTM 2240	70mils / 1.778 mm	0.53
			80mils / 2.032 mm	0.63
Outgasing (TML)	0.35%	ASTM E595	90mils / 2.286 mm	0.73
			100mils / 2.540 mm	0.81
Continuos Use Temp	-40 to 160℃	***	110mils / 2.794 mm	0.86
			120mils / 3.048 mm	0.93
Dielectric Breakdown Voltage	>5500 VAC	ASTM D149	130mils / 3.302mm	1.00
			140mils /3.556 mm	1.08
Dielectric Constant	3.9 MHz	ASTM D150	150mils / 3.810 mm	1.13
			160mils / 4.064 mm	1.20
Volume Resistivity	1.0X10¹² Ohm-cm	ASTM D257	170mils / 4.318 mm	1.24
			180mils / 4.572 mm	1.32
Fire rating	94 V0	equivalent UL	190mils / 4.826 mm	1.41
			200mils / 5.080 mm	1.52
Thermal conductivity	1.5 W/m-K	ASTM D5470	Visua l/ ASTM D751	ASTM D5470

Company Profile

With a wide range, good quality, reasonable prices and stylish designs, Ziitek thermal conductive interface materials are extensively used in Mainboards, VGA cards, Notebooks, DDR&DDR2 products, CD-ROM ,LCD TV, PDP products, Server Power products, Down lamps, Spotlights, Street lamps, Daylight lamps, LED Server Power products and others.

Standard Sheets Sizes:

8" x 16"(203mm x 406mm)

TIF™ series Individual die cut shapes can be supplied.

FAQ:

Q:Is there promotion price for big buyer?

A:Yes, we do have promotion price for big buyer. Please send us email for inquiry.

Q: Are you trading company or manufacturer ?

A: We are manufacturer in China.

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1.0x10^12 Ohm-Cm Heat Sink Thermal Gap Pad 3.5mm Thickness

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