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Factory Supply Variety Of Thicknesses Thermal Conductive Pad For CPU

Categories Thermal Gap Pad
Brand Name: ZIITEK
Model Number: TIF7180Z thermal pad
Certification: UL
Place of Origin: China
MOQ: 1000pcs
Price: negotiation
Supply Ability: 100000pcs/day
Delivery Time: 3-5 work days
Packaging Details: 1000pcs/bag
Name: Factory Supply Variety of Thicknesses Thermal Conductive Pad for CPU
Thermal conductivity: 7.0 W/m-K
Thickness: 4.5mmT
Material: silicone
Applications: CPU Cooling
keyword: Thermal conductive pad
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Factory Supply Variety Of Thicknesses Thermal Conductive Pad For CPU

Factory Supply Variety of Thicknesses Thermal Conductive Pad for CPU


The TIF7180Z is an extremely soft gap filling material rated at a thermal conductivity of 7.0W/m-K. It is specially formulated for high performance applications requiring low assembly stress. The material offers exceptional thermal performance at low pressures due to the unique filler package and ultra low modulus resin formulation. TIF7180Z is highly conformal to rough or irregular surfaces, allowing excellent wet-out at the interface. Protective liners are supplied on both sides allowing for ease of use.


TIF700Z-Series-Datasheet(E)-REV01.pdf


Performance Thermal Pad With Highly Efficient Thermal Conductivity For CPU Cooling 0


Features


> Good thermal conductive: 7.0 W/mK

> Thickness: 4.5mmT

> hardness:55 shore 00

> Colour: Grey

> Easy release construction
> Electrically isolating
> High durability


Applications


> Automotive electronics
> Set top boxes
> Audio and video components
> IT infrastructure
> GPS navigation and other portable devices
> CD-Rom, DVD-Rom cooling


Typical Properties of TIF7180Z Series
Color
Grey
Visual
Composite Thickness
Thermal Impedance@10psi
(℃-in²/W)
Construction &
Compostion
Ceramic filled silicone elastomer
***
10mils / 0.254 mm
0.16
20mils / 0.508 mm
0.20

Specific gravity

3.45 g/cc

ASTM D297
30mils / 0.762 mm
0.31
40mils / 1.016 mm
0.36
Thickness
4.5mmT
***
50mils / 1.270 mm
0.42
60mils / 1.524 mm
0.48
Hardness

55 Shore 00

ASTM 2240
70mils / 1.778 mm
0.53
80mils / 2.032 mm
0.63
Thermal conductivity
7.0W/mk
ASTMD5470
90mils / 2.286 mm
0.73
100mils / 2.540 mm
0.81
Continuos Use Temp
-40 to 200℃
***
110mils / 2.794 mm
0.86
120mils / 3.048 mm
0.93
Dielectric Breakdown Voltage
>5500 VAC
ASTM D149
130mils / 3.302mm
1.00
140mils /3.556 mm
1.08
Dielectric Constant

4.5MHz

ASTM D150
150mils / 3.810 mm
1.13
160mils / 4.064 mm
1.20
Volume Resistivity
5.2X1013
Ohm-cm
ASTM D257
170mils / 4.318 mm
1.24
180mils / 4.572 mm
1.32
Fire rating
94 V0
equivalent
UL
190mils / 4.826 mm
1.41
200mils / 5.080 mm
1.52
Thermal conductivity

7.0 W/m-K

GB-T32064
Visua l/ ASTM D751
ASTM D5470


Company Profile


Ziitek Electronic Material and Technology Ltd. is a R&D and production company, we have many production lines and processing technology of thermal conductive materials, owns advanced production equipment and optimized process, can provide various thermal solutions for different applications.


Packaging Details & Lead time


The packaging of thermal pad

1.with PET film or foam-for protection

2. use Paper Card To Separate Each Layer

3. export carton inside and outside

4. meet with customers' requirement-customized


Lead Time :Quantity(Pieces):5000

Est. Time(days): To be negotiated


Performance Thermal Pad With Highly Efficient Thermal Conductivity For CPU Cooling 1


FAQ:


Q: Are you trading company or manufacturer ?

A: We are manufacturer in China

Q: How do I request customized samples?

A: To request samples, you can leave us message on website, or just contact us by send email or call us.

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