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| Categories | WCu Alloy |
|---|---|
| Brand Name: | Hypersolid Metal |
| Place of Origin: | China |
| MOQ: | Negotiate |
| Price: | Negitionable |
| Payment Terms: | L/C, D/A, D/P, T/T, Western Union, MoneyGram |
| Supply Ability: | 10000sets/month |
| Delivery Time: | 30 days after receiving down payment |
| Packaging Details: | Standard export cartons |
| Meltingpoint: | 1495℃ |
| Fracturetoughness: | 2.5 MPa·m1/2 |
| Alloy Type: | WCu |
| Tensile Strength: | 800-1000 MPa |
| Melting Point: | 3420°C |
| Density: | 15.63 g/cm3 |
| Thermal Conductivity: | 180-200 W/m·K |
| Material: | Tungsten Copper Alloy |
| Company Info. |
| Luoyang Hypersolid Metal Tech Co., Ltd |
| Verified Supplier |
| View Contact Details |
| Product List |
1,Description:
Material: Tungsten copper alloy plates are composed of a mixture of tungsten and copper. The alloy combines the high strength and thermal conductivity of tungsten with the excellent electrical conductivity of copper.
Composition: Tungsten copper alloy plates typically have a tungsten content ranging from 70% to 90%, with the remaining portion being copper. Different compositions can be tailored to meet specific requirements for thermal and electrical properties.
High Strength: Tungsten copper alloy plates exhibit high strength and hardness, making them suitable for applications requiring resistance to wear, deformation, and high mechanical stresses.
Thermal Conductivity: Tungsten copper alloy plates possess good thermal conductivity, allowing for efficient heat dissipation and thermal management in various applications.
Electrical Conductivity: Tungsten copper alloy plates have excellent electrical conductivity, making them suitable for electrical and electronic applications that require both high strength and good electrical performance.
2,Specifications:
| Physical Property | Description |
|---|---|
| Composition | Tungsten and copper alloy |
| Tungsten Content | 70% - 90% |
| Copper Content | 10% - 30% |
| Density | 14.0 - 16.5 g/cm³ |
| Hardness | 200 - 400 HB (Brinell Hardness) |
| Thermal Conductivity | 180 - 230 W/m·K |
| Electrical Conductivity | 25 - 90% IACS (International Annealed Copper Standard) |
| Coefficient of Thermal Expansion | 6.5 - 9.0 x 10^-6 /K |

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