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| Categories | Thermal Pad Material |
|---|---|
| Brand Name: | AOK |
| Model Number: | TP |
| Certification: | RoHS, Reach, UL |
| Place of Origin: | China |
| MOQ: | 1000pcs |
| Payment Terms: | T/T |
| Delivery Time: | 13-15working days |
| Packaging Details: | 400mmx200mm |
| Product Name: | Pink Silicone High Thermal Conductive Thermal Pad Material With 8.0w For Cpu |
| Composition: | Silicone |
| Thermal conductivity: | 8.0±0.5（W/m.K） |
| Color: | Pink |
| Dielectric Constant: | 7.2（@10mhz） |
| Volume Resistivity: | 1.0*10^12（Ω.cm） |
| Attribute | Value | Test Method |
|---|---|---|
| Composition | Ceramic Filler + Silicone | - |
| Color | Pink | Visual |
| Thickness(mm) | 0.5~10 | astm d374 |
| Density(g/cc) | 3.35 | ASTM D792 |
| Hardness(shore oo) | 55±10 | ASTM D2240 |
| Usage Temperature(℃) | -40~150 | -- |
| Electrical | ||
| Breakdown Voltage(kv/mm) | ＞6.0 | ASTM D149 |
| Dielectric Constant(@10mhz) | 7.2 | ASTM D150 |
| Volume Resistivity(Ω.cm) | 1012 | ASTM D257 |
| Flammability | V-0 | UL94 |
| Thermal | ||
| Thermal conductivity(W/m.K) | 8.0±0.5 | ASTM D5470 |
Product feature
■ Thermal conductivity:8.0W/m.K
■ High thermal conductivity
■ Low oil permeability
■ High electrical insulation
■ High compression rate
■ Low compression force
Typical applications
■ Between electronic components such as Semiconductor, IC, CPU.MOS
and heatsink.
■ Led Lighting, LCD TV, Telecom device, wireless Hub,NB, PC, power
supply etc
■ CD ROM/DVD ROM
■ Cooling Module, Thermal module, in all applications where a metal
housing is used as heatsink.
Purchase information:
Standard size: T≤1.5mm,size=200*400mm; T＞1.5mm,size=150*150; which can be die-cut into various sizes and shapes as specified by customers. The increasing gradient of thickness is 0.25mm.
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